Patents Assigned to TS Heatronics Co., Ltd.
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Patent number: 7732950Abstract: A radiator for a linear or curved mobile motor for removing the thermal distortion of a mover and a transporting member of a linear or curved mobile motor, and a high-accuracy, high-reliability linear or curved mobile motor using it. The linear or curved mobile motor includes a field pole having a plurality of permanent magnets with different magnetic poles arranged alternately along a field yoke, and an armature arranged opposite to the field pole via a magnetic gap and formed by winding a single or a plurality of coils around a core. The field pole is used as a stator and the armature being used as a mover that is relatively moved along the longitudinal direction of the stator.Type: GrantFiled: July 25, 2005Date of Patent: June 8, 2010Assignee: TS Heatronics Co., Ltd.Inventors: Tatsuya Yamaoka, Kazuyoshi Suzuki
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Publication number: 20080030081Abstract: A radiator for a linear or curved mobile motor for removing the thermal distortion of a mover and a transporting member of a linear or curved mobile motor, and a high-accuracy, high-reliability linear or curved mobile motor using it. The linear or curved mobile motor includes a field pole having a plurality of permanent magnets with different magnetic poles arranged alternately along a field yoke, and an armature arranged opposite to the field pole via a magnetic gap and formed by winding a single or a plurality of coils around a core. The field pole is used as a stator and the armature being used as a mover that is relatively moved along the longitudinal direction of the stator.Type: ApplicationFiled: July 25, 2005Publication date: February 7, 2008Applicant: TS HEATRONICS CO., LTD.Inventors: Tatsuya Yamaoka, Kazuyoshi Suzuki
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Patent number: 6889753Abstract: A capillary tube heat pipe and the like are provided, in which is applicable for a case that a heat receiving portion is separated apart from a heat radiating portion, and a sufficient space for connecting the both portions does not exist. This capillary tube heat pipe (1) is provided with two turn portions (a heat receiving portion and a heat radiating portion) (3-1) and (3-2) at the both ends thereof and a straight portion (a heat transfer portion) (5) extending between the both turn portions (3), and has a closed loop structure in which both terminals of a single pipe are communicated. Since the heat transfer portion is made from two straight pipes (7) and (9), the straight portion (5) can be small in size.Type: GrantFiled: December 17, 2002Date of Patent: May 10, 2005Assignee: TS Heatronics Co., Ltd.Inventors: Masayoshi Takamizawa, Takashi Kaneko
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Patent number: 6655450Abstract: A forced oscillatory flow type heat pipe of which a ratio (motion coefficient) of the heat transport capacity to the oscillating energy is maintained within an appropriate range is provided. A heat pipe body (1) has a closed loop flow path (2). Operation of the vibrator (3), which is provided at a connecting portion (2a) between the ends of the flow path (2), causes an oscillatory flow of the charged liquid sealed in the flow path (2). The phases of the oscillatory flows of the charged liquid in the adjacent tube portions of the flow path are inverted. From a viewpoint that the dimensionless effective thermal diffusivity kef* of the COSMOS type heat pipe has a larger range in the modified Womersley number &agr; than that of the dream type heat pipe, the modified Womersley number &agr; is 0.4 to 7.Type: GrantFiled: May 31, 2002Date of Patent: December 2, 2003Assignee: TS Heatronics Co., Ltd.Inventors: Shigefumi Nishio, Hisashi Tanaka, Kouji Kubo
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Publication number: 20030111212Abstract: A capillary tube heat pipe and the like are provided, in which is applicable for a case that a heat receiving portion is separated apart from a heat radiating portion, and a sufficient space for connecting the both portions does not exist. This capillary tube heat pipe (1) is provided with two turn portions (a heat receiving portion and a heat radiating portion) (3-1) and (3-2) at the both ends thereof and a straight portion (a heat transfer portion) (5) extending between the both turn portions (3), and has a closed loop structure in which both terminals of a single pipe are communicated. Since the heat transfer portion is made from two straight pipes (7) and (9), the straight portion (5) can be small in size.Type: ApplicationFiled: December 17, 2002Publication date: June 19, 2003Applicant: TS Heatronics Co., Ltd.Inventors: Masayoshi Takamizawa, Takashi Kaneko
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Publication number: 20020189792Abstract: A forced oscillatory flow type heat pipe of which a ratio (motion coefficient) of the heat transport capacity to the oscillating energy is maintained within an appropriate range is provided. A heat pipe body (1) has a closed loop flow path (2). Operation of the vibrator (3) , which is provided at a connecting portion (2a) between the ends of the flow path (2), causes an oscillatory flow of the charged liquid sealed in the flow path (2). The phases of the oscillatory flows of the charged liquid in the adjacent tube portions of the flow path are inverted. From a viewpoint that the dimensionless effective thermal diffusivity kef* of the COSMOS type heat pipe has a larger range in the modified Womersley number &agr; than that of the dream type heat pipe, the modified Womersley number &agr; is 0.4 to 7.Type: ApplicationFiled: May 31, 2002Publication date: December 19, 2002Applicant: TS Heatronics Co., Ltd.Inventors: Shigefumi Nishio, Hisashi Tanaka, Kouji Kubo
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Patent number: 6360813Abstract: An electronic component cooling apparatus includes an air-cooled or water-cooled heat radiating portion and a meandering capillary tube heat pipe which carry out heat transfer between a board having electronic components mounted thereon and the heat radiating portion. The heat radiating portion comprises a plate fin type radiator 21 with an outer-shape of a substantially flat plate. The meandering capillary tube heat pipe is a plate type heat pipe 13 with an outer-shape of a substantially flat plate. The meandering capillary 13c is connected along a surface of the heat radiating portion. Since the meandering capillary tube heat pipe has a very large heat transfer capacity and is able to transfer heat over a long distance with low thermal resistance, it is possible to separate the board apart from the heat radiating portion. Accordingly, flexibility in arrangement of the electronic components or the heat radiating portion is so improved that various shaped apparatus can be designed and manufactured.Type: GrantFiled: May 19, 2000Date of Patent: March 26, 2002Assignee: TS Heatronics Co., Ltd.Inventors: Takahiro Katoh, Kiyoo Amako