Patents Assigned to TSC, Inc.
  • Patent number: 11920719
    Abstract: A heater system for a pipe for controlling a temperature of a heater installed to surround a pipe and performing a heating or insulation function.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: March 5, 2024
    Assignee: TSC INC.
    Inventors: Oh Su Kim, John Ho Kuk
  • Patent number: 11713841
    Abstract: A heater for a pipe, includes a heater body part having a longitudinal cutting line formed in the entire thickness section to form a pair of longitudinal cutting planes in the entire length section, a heating wire installed in the heater body part, and a restraint operating part installed at the heater body part and restraining the pair of longitudinal cutting planes not to be spaced apart from each other. Each of the longitudinal cutting planes includes: a longitudinal outer cutting area disposed in a thickness direction from an outer surface of the heater body part, a longitudinal intermediate cutting area extending from the longitudinal outer cutting area in a circumferential direction of the heater body part, and a longitudinal inner cutting area extending from the longitudinal intermediate cutting area to reach the inner surface of the heater body part in the thickness direction of the heater body part.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: August 1, 2023
    Assignee: TSC INC.
    Inventors: Oh Su Kim, John Ho Kuk
  • Publication number: 20230166299
    Abstract: A wafer polishing apparatus includes a base support; a polishing pad on the base support; a polishing head on an upper portion of the base support and configured to rotate; a polishing head support on the upper portion of the base support and connected to the polishing head, a retainer ring attached to a lower portion of the polishing head; an illumination device configured to provide light to at least a part of an inner surface of the retainer ring; and a camera device configured to capture an image of at least a part of the inner surface of the retainer ring while the polishing head rotates. The polishing head support may be configured to rotate on the base support such that the polishing head is on at least one of a treatment region or a maintenance region of the base support.
    Type: Application
    Filed: July 21, 2022
    Publication date: June 1, 2023
    Applicants: Samsung Electronics Co., Ltd., TSC INC
    Inventors: Jongsu KIM, Johnho KUK, Sunil PARK, Kwangsung LEE, Yoichiro IWA, Sewon JEON, Youngho JUNG
  • Patent number: 11003173
    Abstract: Disclosed herein is an identifier based communication system including: a common communication path; a center station having a center station communication module and a center station controller connected to the center station communication module and connected to the common communication path through the center station communication module; and a plurality of distribution stations each including a distribution station communication module connected to the common communication path, a distribution station controller connected to the distribution station communication module, and a distribution station memory connected to the distribution station controller and storing a determined identifier value of the distribution station, wherein the center station controller transmits an identifier setting mode command including a center transmission preliminary identifier value to the distribution stations following an identifier setting request input from the outside; each of the distribution stations includes a distri
    Type: Grant
    Filed: November 29, 2019
    Date of Patent: May 11, 2021
    Assignee: TSC INC.
    Inventors: Oh Su Kim, Byeong-Ho Kwon, Sun Il Park, John Ho Kuk, Sun Tai Park, Dae Kuk Kim
  • Patent number: 10820436
    Abstract: A utility box which includes a concave-shaped box having a box opening on a top end of the box and a cover plate installed on the box to cover the box opening. The box has a box body, a box shoulder, and a box opening formed on the top end of the box. A pair of lower horizontal guide surfaces are disposed parallel to each other. The box shoulder has a shoulder body and a pair of upper horizontal guide surfaces. A cover plate is formed to have a cover plate wide width portion and is installed in such a manner that the cover plate wide width portion is supported on the lower horizontal guide surfaces. A cover plate opening/closing support controls the cover plate. The box body has improved inner space utilization and a region of its cover plate has a simple structure.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: October 27, 2020
    Assignee: TSC INC.
    Inventors: Oh Su Kim, John Ho Kuk, Woo-Seung Kim
  • Patent number: 10165626
    Abstract: Disclosed is a pipe heater comprising a tubular heat insulating layer having a pair of separating surfaces formed over the entire length thereof, an external cover bonded to the outer surface of the heat insulating layer to enclose the heat insulating layer, a heating layer provided inside the heat insulating layer and including a heating wire therein, and an internal cover provided inside the heating layer to enclose the heating layer, wherein the heat insulating layer includes a polyimide foam layer formed of polyimide foam, and a protection layer is interposed between the heat insulating layer and the heating wire to prevent bubbles distributed in the polyimide foam layer from dissipating due to heat transferred from the heating wire.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: December 25, 2018
    Assignee: TSC Inc.
    Inventors: Oh Su Kim, Sun Il Park
  • Patent number: 10131031
    Abstract: Disclosed is a chemical-mechanical wafer polishing device having an elastic membrane including a circular action plate portion, a membrane circumferential wall portion extending from a circumferential edge of the action plate portion along a direction perpendicular to a plate surface, and a chamber formed between the action plate portion and the membrane circumferential wall portion. The membrane includes a cooling channel portion having an action plate bottom surface section, and a supply penetration section penetrating the action plate portion such that one end is connected to the action plate bottom surface section and the other end is exposed to the upper side of the action plate portion. The chemical-mechanical wafer polishing device includes a cooling fluid supply portion having a cooling fluid supply tube connected to a free end of the supply penetration section, and providing a cooling fluid to the cooling channel portion.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: November 20, 2018
    Assignee: TSC Inc.
    Inventors: Oh Su Kim, Byung Ho Kwon
  • Patent number: 8140396
    Abstract: A safety stock amount calculation method includes calculating a probability Pb that a delivery time for a certain commodity required by a customer is shorter than its lead time L, calculating an average value LL of a difference between the lead time L and the customer's required delivery time when the lead time L exceeds the customer's required delivery time, correcting an inventory adjustment period N by using the average value LL, and calculating a safety stock amount SS by the equations SS=PB×k×(?N×F)×?, wherein ? is a standard deviation of demand for the commodity, N is a corrected inventory adjustment period, Pb is a probability, F is a shipment frequency, and k is a safety coefficient.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: March 20, 2012
    Assignee: TSC, Inc.
    Inventor: Takao Suguro
  • Patent number: 7933805
    Abstract: A safety stock amount calculation method includes calculating a probability Pb that a delivery time for a certain commodity required by a customer is shorter than its lead time L, calculating an average LL of a difference between the lead time L and the customer's required delivery time when the lead time L exceeds the customer's required delivery time, correcting an inventory adjustment period N by using the average value LL, and calculating a safety stock amount SS by the equations SS=Pb×k×(?N×F)×?, wherein ? is a standard deviation of demand for the commodity, N is a corrected inventory adjustment period, Pb is a probability, F is a shipment frequency, and k is a safety coefficient.
    Type: Grant
    Filed: August 12, 2003
    Date of Patent: April 26, 2011
    Assignee: TSC, Inc.
    Inventor: Takao Suguro