Abstract: The notch polishing machine employs a plurality of polishing tapes which can be sequentially introduced into the notch of a wafer to polish both sides of the notch, i.e. the top and bottom surfaces. Each tape is pulled off a supply reel and passed into a mounting block sized to fit into the wafer notch. Each block is also mounted to be oscillated to effect a polishing action. Also, all the blocks are mounted in common to be pivoted between a position angularly disposed relative to the top of the top of the wafer and a position angularly disposed relative to the bottom of the wafer.

Abstract: A system and method for holding a semiconductor wafer substantially flat on a chuck and for cooling the chuck is provided. The system for securing a wafer on a chuck includes first and second conduits, first and second valves, and a first sensor. The first and second conduits each fluidly connect a first plurality of holes in the chuck to a vacuum source. The first and second valves are disposed within the first and second conduits respectively. The first sensor is in fluid communication with one of the first and second valves. The first sensor measures a first vacuum level applied to one of the first and second valves. In operation, one of the first and second valves opens to induce a vacuum force between the first plurality of holes in the chuck and a wafer disposed on the chuck. When the first vacuum level applied to one of the first and second valves is greater than a predetermined vacuum level, the wafer has been partially pulled down against the chuck.

Abstract: A chuck is provided for holding a semiconductor wafer using a suction force. The chuck includes a chuck plate and may further include a manifold plate, and a seal plate to form a laminated chuck configuration. The chuck plate is disposed about a first axis and includes a first contact region disposed on a first side. The chuck plate further includes a first groove within the first contact region extending generally spirally outwardly from a first location proximate to the first axis to a second location within the first contact region. The chuck plate further includes a first plurality of vacuum holes extending from the first groove into the first side of the chuck plate. A method is provided for a probing a test pad on a semiconductor die disposed on a semiconductor wafer and removing an oxide layer disposed on the test pad. A probe needle contacts the test pad and is overdriven less than or equal to 1 micron into the test pad.

Abstract: A wafer scrubbing machine is provided with a network of wafer holders which can be moved from a retracted position adjacent each other at a wafer receiving station to an expanded position spaced apart from each within a scrubbing station. The wafers are picked up simultaneously by pairs of depending arms in the scrubbing station and passed between pairs of rotating brushes for cleaning purposes. A common drive wheel is provided to rotate the wafers simultaneously during scrubbing between the brushes. A second network of wafer holders is provided to receive the scrubbed wafers in the scrubbing station and to move into a retracted position within a delivery station for transfer of the cleaned wafers into a cassette for subsequent processing. Two sets of networks may be provided on a common rotatable assembly in order to accommodate two different sizes of delivered wafers.