Abstract: A UV LED reactor includes a housing having an inlet, an outlet and a reactor chamber; a UV LED module mounted to the housing configured to emit UV radiation into the reactor chamber having a selected wavelength range and with a selected energy (E); and a heatsink on the UV LED module configured to dissipate heat generated by the UV LED module. The heatsink on the UV LED module includes one or more surfaces in thermal communication or physical contact with the fluid, which improves the efficiency of heat transfer from the heatsink to the fluid and eliminates the need for cooling fans. The UV LED reactor can also include a UV transparent inner tube mounted to the inlet for generating a double UV exposure flow path through the reactor chamber. The UV LED reactor can also include a UV reflective coating on the sidewalls of the housing, or on a separate tube or sleeve mounted to the housing, configured to reflect UV radiation onto the fluid in the reactor chamber.

Abstract: A nail product curing system for curing nail products includes a housing having a nail treatment space configured to receive a hand of a user and to position one or more nails of the user, and one or more LED light sources on the housing for generating light in the nail treatment space for performing a curing process. The nail product curing system also includes a sensing and controlling system that includes touchless sensors on the housing configured to sense placement of the hand in the nail treatment space, and to control various parameters of the curing process using movement of the user's hands. The sensing and controlling system also includes a circuit board on the housing and a radio transmission controller in signal communication with the circuit board configured to control the LED light sources and the curing process using programmed instructions.

Abstract: A UV LED package includes a substrate having a dam, a LED die on the substrate, a lens bonded to the substrate, an extraction layer covering a light emitting surface of the LED die, and a lens sealing layer between the lens and the dam. The extraction layer can be formed to provide a precise gap G between the lens and the light emitting diode (LED). In addition, the materials for the lens and the extraction layer can be selected, and the gap G can be precisely dimensioned, to reduce refraction and reflection, to improve radiation extraction, to reduce power radiance, and to improve the efficiency of the UV LED package.

Abstract: A UV LED package includes a substrate having a dam, a LED die on the substrate, a lens bonded to the substrate, an extraction layer covering a light emitting surface of the LED die, and a lens sealing layer between the lens and the dam. The extraction layer can be formed to provide a precise gap G between the lens and the light emitting diode (LED). In addition, the materials for the lens and the extraction layer can be selected, and the gap G can be precisely dimensioned, to reduce refraction and reflection, to improve radiation extraction, to reduce power radiance, and to improve the efficiency of the UV LED package.

Abstract: A semiconductor component for fabricating semiconductor structures includes a plate having an elastomeric polymer layer thereon and at least one semiconductor structure adhesively attached to the elastomeric polymer layer. A semiconductor structure includes a first semiconductor layer and a second semiconductor layer with an active layer therebetween. The semiconductor structure also includes a plurality of mesas including at least one shorting mesa and at least one non-shorting mesa physically connected to the first semiconductor layer. A method for fabricating semiconductor structures includes the steps of: forming a plurality of semiconductor layer structures on the substrate, forming an elastomeric polymer layer on a receiving plate and attaching the elastomeric polymer layer to the semiconductor structures, and separating the semiconductor structures from the substrate with the semiconductor structures attached to the receiving plate.

Abstract: A light emitting device includes a circuitry substrate and multiple light emitting diodes (LEDs) bonded to the circuitry substrate in a spaced array. The light emitting device also includes a continuous and substantially flat wavelength conversion member covering the light emitting diodes (LEDs) configured to convert the electromagnetic radiation emitted by the light emitting diodes (LEDs) into another wavelength range. The light emitting device also includes a planarized layer configured to support the wavelength conversion member on the circuitry substrate. The light emitting device can also include a light shaper on the wavelength conversion member configured to form emitting windows for the electromagnetic radiation transmitted through the wavelength conversion member forming an output light beam having a desired emitting window size, shape, and edge and to block and minimize scattered electromagnetic radiation from the wavelength conversion layer.

Abstract: A light emitting diode (LED) bulb includes a base, a low beam emitter on the base configured to generate light rays to form a low beam, and a high beam emitter on the base configured to generate light rays to form a high beam. The low beam emitter includes two substrates separated by a core and configured as a heat sink, at least two low beam light emitting diode (LED) dice mounted to the substrates configured to emit the low beam light rays, and a shutter configured to block some of the low beam light rays and to shape the low beam. A lighting system includes the light emitting diode (LED) bulb and a reflector configured to generate the high beam and the low beam. In addition, the (LED) bulb can be retrofitted to conventional lighting systems, such as automotive lighting systems, having conventional reflectors.

Abstract: A light emitting diode (LED) bulb includes a base, a low beam emitter on the base configured to generate light rays to form a low beam, and a high beam emitter on the base configured to generate light rays to form a high beam. The low beam emitter includes two substrates separated by a core and configured as a heat sink, at least two low beam light emitting diode (LED) dice mounted to the substrates configured to emit the low beam light rays, and a shutter configured to block some of the low beam light rays and to shape the low beam. A lighting system includes the light emitting diode (LED) bulb and a reflector configured to generate the high beam and the low beam. In addition, the (LED) bulb can be retrofitted to conventional lighting systems, such as automotive lighting systems, having conventional reflectors.