Patents Assigned to TTI CO., LTD.
  • Publication number: 20230258508
    Abstract: The present invention relates to a time-temperature indicating module that causes a spread material whose degree of diffusion changes with temperature change to be absorbed and diffused into a diffusion material through induction of a crack, guides a diffusion direction of the spread material through a guide line printed in a longitudinal direction of the diffusion material and also enables a clear start time point of diffusion to be displayed.
    Type: Application
    Filed: April 25, 2023
    Publication date: August 17, 2023
    Applicant: TTI CO., LTD.
    Inventors: Ji Hoon PARK, Bong Soo KWON
  • Patent number: 11467038
    Abstract: The present invention relates to the time-temperature indicating module which allows the user to trigger the bursting of the starting member with a simple motion and generate a crack so that the spread material interposed inside spreads via the crack. The present invention also relates to the manufacturing method of the time-temperature indicating module that strengthens a sealed section of the time-temperature indicating module using laminating by heat sealing to prevent the spread material from leaking or flowing out.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: October 11, 2022
    Assignee: TTI CO., LTD.
    Inventors: Bong-Soo Kwon, Ji-Hoon Park, Young-Suk Jeon, Guan-O Lee, Byeong-Han Lim, Jin-Hee Jung, Cheong-Hoon Cho
  • Publication number: 20180372549
    Abstract: The present invention relates to the time-temperature indicating module which allows the user to trigger the bursting of the starting member with a simple motion and generate a crack so that the spread material interposed inside spreads via the crack. The present invention also relates to the manufacturing method of the time-temperature indicating module that strengthens a sealed section of the time-temperature indicating module using laminating by heat sealing to prevent the spread material from leaking or flowing out.
    Type: Application
    Filed: July 27, 2018
    Publication date: December 27, 2018
    Applicant: TTI CO., LTD.
    Inventors: Bong-Soo KWON, Ji-Hoon PARK, Young-Suk JEON, Guan-O LEE, Byeong-Han LIM, Jin-Hee JUNG, Cheong-Hoon CHO