Abstract: A system to improve pilot voice communication includes: a microphone capturing pilot speech during operational use of an aircraft; and an audio subsystem that stores recordings of the captured pilot speech during different periods of the operational use. A pilot recording selection graphic user interface permits selection by the pilot of recordings made during a low stress period of his/her operational use of the aircraft, and one or more recordings made during a high stress period. A training algorithm analyzes characteristics of the selected recordings made during the low stress period to set a baseline. The training algorithm subsequently analyzes real-time pilot speech to ascertain when its characteristics are increased by a threshold amount over the baseline, which is classified as speech made under stress. The audio system alters and improves the analyzed real-time speech made under stress by converting it to normal-sounding speech, minimizing propagation of stressed speech.

Abstract: A device may perform a first full-matrix optical scan covering a first scan area and having a first resolution to identify a first maximum power spot within a region where the optical signal is detected when a first MEMS micro-mirror and a second MEMS micro-mirror are concurrently at their respective first maximum power positions. The device may perform a second full-matrix optical scan centered around the first maximum power spot, the second full-matrix optical scan covering a second scan area smaller than the first scan area and having a second resolution finer than the first resolution. The device may identify a second maximum power spot within the first maximum power spot when the first MEMS micro-mirror and the second MEMS micro-mirror are concurrently at their respective second maximum power positions. The device may lock the respective second maximum power positions of the first MEMS micro-mirror and the second MEMS micro-mirror.

Abstract: The disclosure provides designs and methods of fabrication of stacked double junction circulator device that includes two or more ferrite elements. The disclosed stacked double junction circulator device uses a single magnet, instead of two magnets that are conventionally used for the side-by-side double junction circulator. The disclosed stacked double junction circulator device offers significant advantages in regards to installation requirements on the customer side.

Abstract: A circulator for radio frequency is provided. The circulator may include a ferrite stripline assembly, which includes a first ferrite layer, a second ferrite layer over the first ferrite layer, and a junction circuit between the first ferrite layer and the second ferrite layer. The circulator may also include a magnet over the second ferrite layer for providing magnetic bias.

Abstract: A device includes a top ferrite layer and a bottom ferrite layer. The device also includes a first circuit stack between the top ferrite layer and the bottom ferrite layer. The first circuit stack includes a first dielectric layer and a circulator circuit including a first circuit portion on a first side of the first dielectric layer and a second circuit portion on a second side of the first dielectric layer opposite the first side. The first circuit portion is different from the second circuit portion. The device also includes a second circuit stack including a second dielectric layer and a top ground layer disposed over the second dielectric layer. The second circuit stack is disposed over the top ferrite layer.

Abstract: A passive alignment system includes a base substrate, a lower cladding layer disposed over the base substrate, a core layer disposed over the lower cladding layer, and an upper cladding layer disposed over the core layer. The passive alignment system also includes one or more planar waveguides including one or more cores formed in a first portion of the core layer disposed over a first portion of the lower cladding layer, the one or more cores extending from a transmitting end to a receiving end in an X-Y plane. The passive alignment system also includes at least one alignment feature formed in a second portion of the core layer disposed over a second portion of the lower cladding layer and configured to align with an optical receiving or transmitting device. The at least one alignment feature aligns the optical receiving or transmitting device with the one or more planar waveguides.

Abstract: A method is provided for modifying a via from a PCB including a plurality of subassemblies comprising a plurality of layers. The method may include drilling a via of the PCB to form a through-hole to remove an unwanted material in the via of the PCB. The method may also include depositing a carbon-based material over an inner wall of the through-hole. The method may further include back drilling a first portion of the through-hole by a drill from the top of the PCB to form a first blind via. The method may also include selectively plating a conductive material over the carbon-based material to form a plated through-hole.

Abstract: A printed circuit board (PCB) core structure is provided for the transition of signals from one side of a PCB to an opposing side of the PCB. The PCB core structure may include a laminated core including an inner core including a plurality of conductive layers (N layers), a first dielectric layer, a first conductive trace disposed over the Nth conductive layer on a first side of the laminated core. The PCB core structure may also include a signal via extending from a first conductive layer to an Nth conductive layer through the laminated core, the signal via configured to connect the first conductive trace to a pin or a second conductive trace on a second side of the laminated core. The PCB core structure may also include a shielding structure surrounding the signal via and partially extending from the first conductive layer to the Nth conductive layer.

Abstract: The disclosure provides a low-cost near-hermetic package, which may a substrate configured to support one or more internal components. The package may also include an enclosure comprising a cavity surrounding the one or more internal components and a first sidewall extending upward from the substrate. The first sidewall may be coupled to the substrate. The package may further include a first flexible circuit comprising conductive traces configured to connect to the one or more internal components. The first flexible circuit may include a first section outside the first sidewall of the enclosure, a second section inside the enclosure, and a third section between the first section and the second section joining to the enclosure and the substrate.

Abstract: A printed circuit board (PCB) having an engineered thermal path and a method of manufacturing are disclosed herein. In one aspect, the PCB includes complementary cavities formed on opposite sides of the PCB. The complementary cavities are in a thermal communication and/or an electrical communication to form the engineered thermal path and each cavity is filled with a thermally conductive material to provide a thermal pathway for circuits and components of the PCB. The method of manufacturing may further include drilling and/or milling each cavity, panel plating the cavities and filling the cavities with a suitable filling material.

Abstract: The disclosure relates to a high-density optical waveguide structure, a printed circuit board and a preparation method thereof. The high-density optical waveguide structure comprises an undercladding layer, a core layer and an upper cladding layer in sequence; wherein, the lower cladding layer is arranged at intervals. The trench is filled with an optical waveguide material to form a core layer. The waveguide structure integrates an optical waveguide into a PCB to realize photoelectric interconnection. The waveguide structure can better achieve higher parallel interconnection density, maintain good signal integrity, reduce device and device size, and at the same time, consume less power. The structure is configured to easily dissipate heat, enabling a simpler physical architecture and design, maximizing the wiring space of printed circuit boards, facilitating the fabrication of ultra-fine wire boards; and improving the wiring density and reliability of existing manufacturing methods.

Abstract: A method for cleaning components of a system for filling holes in a printed circuit board with a fluid fill material includes removing the components being a dispensing head and a manifold connected to the dispensing head preferably as a single unit. The single unit is retained in that format. Excess fluid material from the dispensing head and manifold is evacuated preferably by passing air through the dispensing head and manifold. Then the dispensing head and manifold is placed in a cleaning tub, and the manifold is attached to a solvent pump line. The dispensing head and manifold is flushed with a flow of solvent from the solvent pump line; and excess solvent from the dispensing head and manifold is evacuated, by passing air through the dispensing head and manifold.

Abstract: There is a system for filling holes in a printed circuit board with a fluid fill material. The system receives a printed circuit board vertically within a main body. There is a dispensing head for selectively dispensing a fill material onto the vertically placed circuit board, the dispensing head having a plurality of holes. A feeding reservoir contains the fill material, and the feeding reservoir has a first end and a second end. An outlet system comprises a flow line connected to the first end of the feeding reservoir, and the flow line provides a flow path for the fill material from the first end of the feeding reservoir to the dispensing head. The flow line is attached to a manifold connected to the dispensing head, the manifold including connectors between the branches and with the absence of 90° elbows in the flow path.

Abstract: There is a system for filling holes in a printed circuit board with a fluid fill material. The system receives a printed circuit board vertically within a main body. There is a dispensing head for selectively dispensing a fill material onto the vertically placed circuit board, the dispensing head having a plurality of holes. A feeding reservoir contains the fill material, and the feeding reservoir has a first end and a second end. An outlet system comprises a flow line connected to the first end of the feeding reservoir, and the flow line provides a flow path for the fill material from the first end of the feeding reservoir to the dispensing head. The flow line is attached to a manifold connected to the dispensing head, the manifold including connectors between the branches and with the absence of 90° elbows in the flow path.

Abstract: A method for cleaning components of a system for filling holes in a printed circuit board with a fluid fill material includes removing the components being a dispensing head and a manifold connected to the dispensing head preferably as a single unit. The single unit is retained in that format. Excess fluid material from the dispensing head and manifold is evacuated preferably by passing air through the dispensing head and manifold. Then the dispensing head and manifold is placed in a cleaning tub, and the manifold is attached to a solvent pump line. The dispensing head and manifold is flushed with a flow of solvent from the solvent pump line; and excess solvent from the dispensing head and manifold is evacuated, by passing air through the dispensing head and manifold.

Abstract: A method for determining material density variations and prediction of defects on a multi-layer printed circuit board (PCB), in the X, Y, and Z axis, includes a virtual grid creation system and a set of rules for determining the material density in each grid element in the grid system.

Abstract: A printed wiring board (PWB) comprises an inner high density circuit routing component laminated within the wiring board, and plated through holes electrically coupling the inner high density circuit to a conductive pattern located on a surface of the PWB. A preferred method for forming such a PWB comprises: providing a built up high density routing component; providing two wiring boards; laminating the built up routing component between the two wiring boards; and using plated through holes to electrically connect a conductive portion of each of the wiring boards to the built up routing component.