Patents Assigned to Turning Point Lasers Corporation
  • Patent number: 11888285
    Abstract: A low numerical aperture fiber output diode laser module, which having several independent diode lasers, and collimated and converged the light beam, for the coupling the light to the core optical fiber with a core diameter of 105 um and a numerical aperture of 0.12. Compared with general products with a numerical aperture of 0.22, the light output angle is reduced to 55%, and use a general blue laser diode for verification. Use an optical software for facilitating the design and optimization of the parameters of the optical lens module.
    Type: Grant
    Filed: July 27, 2021
    Date of Patent: January 30, 2024
    Assignee: Turning Point Lasers Corporation
    Inventors: Chi-Luen Wang, Hung-Sheng Lee, Tai-Ming Chang, Chun-Hui Yu, Yu-Ching Yeh, Sheng-Ping Lai, Shih-Wei Lin, Yuan-He Teng, Li-Chang Tsou, Szutsun Simon Ou
  • Publication number: 20230402822
    Abstract: A manufacturing method of a semiconductor device includes: providing a semiconductor stack layer, wherein the semiconductor stack layer includes a first type semiconductor layer, a quantum well layer, and a second type semiconductor layer stacked in sequence; growing an aluminum nitride layer on the second type semiconductor layer; and annealing the aluminum nitride layer to achieve quantum well intermixing.
    Type: Application
    Filed: November 9, 2022
    Publication date: December 14, 2023
    Applicants: National Tsing Hua University, Turning Point Lasers Corporation
    Inventors: Ci-Ling Pan, Chi-Luen Wang, Hung-Sheng Lee, Li-Chang Tsou, Tzu-Neng Lin