Abstract: A thin plastic elongate mask is disclosed for use in continuously electroplating an elongate substrate. Apparatus is disclosed wherein the mask is mated with the substrate, is passed through an electroplating zone, supported by support belts, such that only those areas of elongate substrate covered by plating cavities in the mask are plated. The mask may be located on the substrate by means of corresponding location features positioned on the elongate substrate and the mask. A method of continuously electroplating an elongate substrate using a thin plastic elongate mask is further disclosed.