Patents Assigned to Twin Creeks Technologies, Inc.
  • PHOTOVOLTAIC CELL COMPRISING A THIN LAMINA HAVING LOW BASE RESISTIVITY AND METHOD OF MAKING
    Publication number: 20090194153
    Abstract: Fabrication of a photovoltaic cell comprising a thin semiconductor lamina may require additional processing after the semiconductor lamina is bonded to a receiver. To minimize high-temperature steps after bonding, the p-n junction is formed at the back of the cell, at the bonded surface. In some embodiments, the front surface of the semiconductor lamina is not doped or is locally doped using low-temperature methods. The base resistivity of the photovoltaic cell may be reduced, allowing a front surface field to be reduced or omitted.
    Type: Application
    Filed: August 10, 2008
    Publication date: August 6, 2009
    Applicant: TWIN CREEKS TECHNOLOGIES, INC.
    Inventors: Mohamed M. Hilali, Christopher J. Petti
  • METHOD TO FORM A PHOTOVOLTAIC CELL COMPRISING A THIN LAMINA
    Publication number: 20090197368
    Abstract: A very thin photovoltaic cell is formed by implanting gas ions below the surface of a donor body such as a semiconductor wafer. Ion implantation defines a cleave plane, and a subsequent step exfoliates a thin lamina from the wafer at the cleave plane. A photovoltaic cell, or all or a portion of the base or emitter of a photovoltaic cell, is formed within the lamina. In preferred embodiments, the wafer is affixed to a receiver before the cleaving step. Electrical contact can be formed to both surfaces of the lamina, or to one surface only.
    Type: Application
    Filed: September 11, 2008
    Publication date: August 6, 2009
    Applicant: TWIN CREEKS TECHNOLOGIES, INC.
    Inventors: Srinivasan Sivaram, Aditya Agarwal, S. Brad Herner, Christopher J. Petti
  • METHOD TO FORM A PHOTOVOLTAIC CELL COMPRISING A THIN LAMINA
    Publication number: 20090194164
    Abstract: A very thin photovoltaic cell is formed by implanting gas ions below the surface of a donor body such as a semiconductor wafer. Ion implantation defines a cleave plane, and a subsequent step exfoliates a thin lamina from the wafer at the cleave plane. A photovoltaic cell, or all or a portion of the base or emitter of a photovoltaic cell, is formed within the lamina. In preferred embodiments, the wafer is affixed to a receiver before the cleaving step. Electrical contact can be formed to both surfaces of the lamina, or to one surface only.
    Type: Application
    Filed: September 11, 2008
    Publication date: August 6, 2009
    Applicant: TWIN CREEKS TECHNOLOGIES, INC.
    Inventors: Srinivasan Sivaram, Aditya Agarwal, S. Brad Herner, Christopher J. Petti
  • METHOD TO FORM A PHOTOVOLTAIC CELL COMPRISING A THIN LAMINA
    Publication number: 20090194163
    Abstract: A very thin photovoltaic cell is formed by implanting gas ions below the surface of a donor body such as a semiconductor wafer. Ion implantation defines a cleave plane, and a subsequent step exfoliates a thin lamina from the wafer at the cleave plane. A photovoltaic cell, or all or a portion of the base or emitter of a photovoltaic cell, is formed within the lamina. In preferred embodiments, the wafer is affixed to a receiver before the cleaving step. Electrical contact can be formed to both surfaces of the lamina, or to one surface only.
    Type: Application
    Filed: September 10, 2008
    Publication date: August 6, 2009
    Applicant: TWIN CREEKS TECHNOLOGIES, INC.
    Inventors: Srinivasan Sivaram, Aditya Agarwal, S. Brad Herner, Christopher J. Petti
  • METHOD TO FORM A PHOTOVOLTAIC CELL COMPRISING A THIN LAMINA
    Publication number: 20090194162
    Abstract: A very thin photovoltaic cell is formed by implanting gas ions below the surface of a donor body such as a semiconductor wafer. Ion implantation defines a cleave plane, and a subsequent step exfoliates a thin lamina from the wafer at the cleave plane. A photovoltaic cell, or all or a portion of the base or emitter of a photovoltaic cell, is formed within the lamina. In preferred embodiments, the wafer is affixed to a receiver before the cleaving step. Electrical contact can be formed to both surfaces of the lamina, or to one surface only.
    Type: Application
    Filed: February 5, 2008
    Publication date: August 6, 2009
    Applicant: Twin Creeks Technologies, Inc.
    Inventors: Srinivasan Sivaram, Aditya Agarwal, S. Brad Herner, Christopher J. Petti