Patents Assigned to TXC Corporation
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Publication number: 20240120900Abstract: A suspended resonator including a vibration structure, a first electrode, and a second electrode is provided. The vibration structure includes a vibration region, a frame portion, and a connecting portion. The vibration region includes a plate portion and a thickening portion. The plate portion has a first surface and a second surface opposite to each other. The thickening portion surrounds a central part of the plate portion, and an edge part of the plate portion is sandwiched in the thickening portion. A thickness of the thickening portion is greater than a thickness of the plate portion. The frame portion surrounds the vibration region and maintains a gap with the vibration region. The connecting portion connects the thickening portion with the frame portion. The first electrode is disposed on the first surface. The second electrode is disposed on the second surface.Type: ApplicationFiled: February 2, 2023Publication date: April 11, 2024Applicant: TXC CorporationInventors: Shih-Yung Pao, Tzu-Hsiu Peng, Zong-De Lin
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Patent number: 11949378Abstract: A crystal oscillator and an oscillating device are provided. The crystal oscillator includes a resonator, a low-thermal conductivity glue, an integrated circuit chip, and a heating element. In the resonator, a crystal blank is hermetically encapsulated. The low-thermal conductivity glue wraps the resonator to suppress temperature variation in the resonator. The integrated circuit chip is disposed below the resonator, and the heating element is configured to supply heat to the resonator.Type: GrantFiled: August 29, 2022Date of Patent: April 2, 2024Assignee: TXC CorporationInventors: Erh-Shuo Hsu, Wan-Lin Hsieh
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Publication number: 20240072729Abstract: A crystal oscillator and an oscillating device are provided. The crystal oscillator includes a resonator, a low-thermal conductivity glue, an integrated circuit chip, and a heating element. In the resonator, a crystal blank is hermetically encapsulated. The low-thermal conductivity glue wraps the resonator to suppress temperature variation in the resonator. The integrated circuit chip is disposed below the resonator, and the heating element is configured to supply heat to the resonator.Type: ApplicationFiled: August 29, 2022Publication date: February 29, 2024Applicant: TXC CorporationInventors: Erh-Shuo Hsu, Wan-Lin Hsieh
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Publication number: 20240048111Abstract: A manufacturing method of a piezoelectric vibration element includes at least the following steps. Quartz wafer is provided. A first metal material layer and a second metal material layer are fully formed on a first surface and a second surface of the quartz wafer, respectively. A first photoresist material layer and a second photoresist material layer are fully formed on the first metal material layer and the second metal material layer, respectively. Only the first photoresist material layer is performed to an exposure and development process to form a first patterned photoresist layer. A portion of the first metal material layer is removed by the first patterned photoresist layer to form a metal pattern. The first patterned photoresist layer and the second photoresist material layer are removed.Type: ApplicationFiled: September 8, 2022Publication date: February 8, 2024Applicant: TXC CorporationInventors: Po-Sheng Huang, Chieh-Jen Cho, Shih-Feng Hsueh, Ching-Jui Chuang, Tzu-Fan Chen, Chiu-Hua Chen
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Publication number: 20240048122Abstract: A resonator including a vibration structure, a first electrode, and a second electrode is provided. The vibration structure includes a vibration region, a protrusion portion, an opening, and a frame portion. The vibration region has a first surface and a second surface opposite to the first surface. The protrusion portion surrounds the vibration region. The opening is disposed at a side of the vibration region and between the vibration region and the protrusion portion. The opening has a first side adjacent to the vibration region and a second side far away from the vibration region. The second side is opposite to the first side. A length of the first side is greater than a length of the second side. The frame portion surrounds the protrusion portion. The first electrode is disposed on the first surface. The second electrode is disposed on the second surface.Type: ApplicationFiled: November 16, 2022Publication date: February 8, 2024Applicant: TXC CorporationInventors: Tzu-Hsiu Peng, Wei-Chen Lo, Zong-De Lin
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Patent number: 11876485Abstract: An oscillating device includes a heater, a thermoelectric cooler, a frequency source, a temperature controlled circuit, and a voltage controlled oscillation circuit. When the ambient temperature is in a low-temperature range, the temperature controlled circuit drives the heater to a target temperature to adjust an operating temperature of the frequency source. When the ambient temperature is in a high-temperature range, the temperature controlled circuit drives the thermoelectric cooler to the target temperature to adjust the operating temperature of the frequency source, and the voltage controlled oscillation circuit drives the frequency source to reduce a frequency variation of the frequency source resulted from the variation of the ambient temperature. Alternatively, the heater or the voltage controlled oscillation circuit may be omitted.Type: GrantFiled: September 13, 2022Date of Patent: January 16, 2024Assignee: TXC CORPORATIONInventors: Wan-Lin Hsieh, Sheng-Hsiang Kao
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Patent number: 11699990Abstract: An oscillating device includes a first quartz crystal resonator, a driving circuit, a first waveform adjustment circuit, and at least two second quartz crystal resonators. The first quartz crystal resonator has a first resonant frequency. The driving circuit, coupled to the first quartz crystal resonator, drives the first quartz crystal resonator to generate a first oscillating signal having the first resonant frequency. The second quartz crystal resonators, coupled in parallel and coupled to the driving circuit and the first quartz crystal resonator, have a second resonant frequency and receive and rectify the first oscillating signal to generate a second oscillating signal having the second resonant frequency. The first waveform adjustment circuit, coupled to the second quartz crystal resonators, receives the second oscillating signal and adjusts the second oscillating signal to generate a first waveform adjustment signal.Type: GrantFiled: August 29, 2022Date of Patent: July 11, 2023Assignee: TXC CORPORATIONInventors: Yu-Liang Chen, Chih-Hsun Chen, Wan-Lin Hsieh, Erh-Shuo Hsu, Sheng-Hsiang Kao
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Publication number: 20230018805Abstract: An oscillating device includes a first quartz crystal resonator, a driving circuit, a first waveform adjustment circuit, and at least two second quartz crystal resonators. The first quartz crystal resonator has a first resonant frequency. The driving circuit, coupled to the first quartz crystal resonator, drives the first quartz crystal resonator to generate a first oscillating signal having the first resonant frequency. The second quartz crystal resonators, coupled in parallel and coupled to the driving circuit and the first quartz crystal resonator, have a second resonant frequency and receive and rectify the first oscillating signal to generate a second oscillating signal having the second resonant frequency. The first waveform adjustment circuit, coupled to the second quartz crystal resonators, receives the second oscillating signal and adjusts the second oscillating signal to generate a first waveform adjustment signal.Type: ApplicationFiled: August 29, 2022Publication date: January 19, 2023Applicant: TXC CORPORATIONInventors: Yu-Liang CHEN, Chih-Hsun CHEN, Wan-Lin HSIEH, Erh-Shuo HSU, Sheng-Hsiang KAO
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Patent number: 11545935Abstract: An oscillator wafer-level-package structure is provided, comprising a bottom layer, an oscillator crystal and a capping layer. The bottom layer includes an upper plane, the capping layer includes a lower plane, and the oscillator crystal is disposed between the bottom layer and the capping layer and includes at least one cavity. An upper seal ring and a lower seal ring are respectively surrounding the oscillator crystal such that the oscillator crystal is sealed in between the capping layer and the bottom layer by employing the upper and lower seal rings. In addition, a diffusion barrier is further disposed in the upper seal ring and in the lower seal ring for avoiding interface diffusion. Moreover, the present invention adopts the same material for fabricating the capping layer, the oscillator crystal and the bottom layer to achieve an optimal thermal stress result when realizing the packaging structure.Type: GrantFiled: May 26, 2021Date of Patent: January 3, 2023Assignee: TXC CorporationInventors: Chih-Hsun Chu, Chih-Hung Chiu, Wun-Kai Wang, Hsiang-Jen Cheng
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Patent number: 11509311Abstract: A temperature-controlled oscillating device includes a supporting base, a mounting glue, an IC, at least one conducting medium, a temperature sensor, a quartz crystal package, and a heater. The mounting glue is formed on the supporting base. The IC is formed on the mounting glue. The conducting medium and the temperature sensor are formed on the IC. The quartz crystal package is formed on the conducting medium. The quartz crystal package includes a first quartz substrate, a second quartz substrate, and a third quartz substrate. The heater is formed on the quartz crystal package or the IC. There is no base arranged between the IC and the quartz crystal package.Type: GrantFiled: August 10, 2021Date of Patent: November 22, 2022Assignee: TXC CORPORATIONInventor: Wan-Lin Hsieh
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Publication number: 20220326085Abstract: An infrared sensor uses an infrared lens with infrared filtering and focusing functions. Thus, an infrared filter can be omitted to reduce the costs and volume. In addition, a getter on the inside of a metal cover of the infrared sensor can be activated when the metal cover is soldered to the substrate of the infrared sensor. Therefore, the packaging process of the infrared sensor can be simplified.Type: ApplicationFiled: May 25, 2021Publication date: October 13, 2022Applicant: TXC CORPORATIONInventors: Tzong-Sheng LEE, Jen-Wei LUO, Chia-Hao WENG, Chun-Chi LIN, Ting-Chun HSU, Hui-Jou YU, Yi-Hung LIN, Sung-Hung LIN
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Patent number: 11469738Abstract: An oscillating device includes a first quartz crystal resonator, a driving circuit, a first buffer, an attenuator, a second quartz crystal resonator, and a second buffer. The first quartz crystal resonator and the second quartz crystal resonator respectively have a first resonant frequency and a second resonant frequency. The driving circuit drives the first quartz crystal resonator to generate a first oscillating signal having the first resonant frequency. The first buffer generates a first clock signal in response to the first oscillating signal. The attenuator reduces the wave swing of the first clock signal to generate an attenuated signal. The second quartz crystal resonator rectifies the attenuated signal to generate a second oscillating signal having the second resonant frequency. The second buffer generates a second clock signal in response to the second oscillating signal.Type: GrantFiled: July 19, 2021Date of Patent: October 11, 2022Assignee: TXC CORPORATIONInventors: Wan-Lin Hsieh, Yu-Liang Chen, Erh-Shuo Hsu, Chih-Hsun Chen, Sheng-Hsiang Kao
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Patent number: 11398797Abstract: A crystal oscillator and a method for fabricating the same is provided. In the method, a crystal package is provided. The crystal package includes a crystal blank and at least one laser-penetrating area. The laser-penetrating area is exposed outside. The crystal package is provided with at least one airtight space therein. At least one getter is formed in the airtight space. The location of the laser-penetrating area corresponds to that of the getter. A laser beam penetrates through the laser-penetrating area to activate the getter, thereby increasing the degree of vacuum of the airtight space.Type: GrantFiled: November 2, 2021Date of Patent: July 26, 2022Assignee: TXC CORPORATIONInventors: Wun-Kai Wang, Cheng-Wei Lin, Chih Hung Chiu, Chih Hsun Chu
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Patent number: 11283403Abstract: A temperature-controlled and temperature-compensated oscillating device and a method of temperature control and temperature compensation is disclosed. The operating temperature of a frequency source is adjusted by driving a heater to a target temperature when the ambient temperature is in a first range between a first temperature and a second temperature higher than the third temperature. The frequency variation of the frequency source resulted from a variation of the ambient temperature is reduced by applying a voltage to the frequency source when the ambient temperature is in a second range between a third temperature and a fourth temperature higher than the third temperature. The third temperature is higher than the first temperature.Type: GrantFiled: December 23, 2020Date of Patent: March 22, 2022Assignee: TXC CORPORATIONInventors: Wan-Lin Hsieh, Sheng-Hsiang Kao
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Patent number: 11121698Abstract: A quartz oscillating plate comprises a substrate having a notch. Two sides of the notch respectively have a first side-electrode and a second side-electrode. The first side-electrode receives an external signal. The external signal is transmitted along the perimeter of the substrate. The notch of the substrate can increase the length of the transmission path of oscillation energy. The present invention can improve the Q value of the quartz oscillator using the quartz oscillating plate and optimize the performance of the products using the quartz oscillator.Type: GrantFiled: October 25, 2018Date of Patent: September 14, 2021Assignee: TXC CorporationInventors: Yen-Chih Lee, Cheng-Hsun Chung, Chih-Hung Chiu, Min-Ho Wang
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Patent number: 10855289Abstract: An oven controlled crystal oscillator consisting includes a substrate, which includes a substrate, at least one base, a crystal blank, a first cover lid, an IC chip, a heat-insulating adhesive, a heater, and a second cover lid. The top of the base is provided with a cavity, and the top of the base is connected to the substrate through conductive wires without using solder. The crystal blank is mounted in the cavity. The first cover lid seals the cavity. The IC chip is mounted on the bottom of the base. The base is mounted on the substrate through the IC chip and the heat-insulating adhesive, and the IC chip is mounted to the bottom of the base. Alternatively, the IC chip and the base are horizontally arranged. The second cover lid is mounted on the top of the substrate.Type: GrantFiled: November 7, 2019Date of Patent: December 1, 2020Assignee: TXC CorporationInventors: Wan-Lin Hsieh, Erh-Shuo Hsu, Shao-Po Sun, Sheng-Hsiang Kao, Yu-Shun Yen
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Patent number: 10511310Abstract: An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.Type: GrantFiled: March 25, 2019Date of Patent: December 17, 2019Assignee: TXC CorporationInventors: Chien-Wei Chiang, Wan-Lin Hsieh, Chia-Wei Chen, Che-Lung Hsu, Sheng-Hsiang Kao, Chen-Ya Weng, Chia-Chen Chen
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Patent number: 10291236Abstract: An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.Type: GrantFiled: November 3, 2016Date of Patent: May 14, 2019Assignee: TXC CorporationInventors: Chien-Wei Chiang, Wan-Lin Hsieh, Chia-Wei Chen, Che-Lung Hsu, Sheng-Hsiang Kao, Chen-Ya Weng, Chia-Chen Chen
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Publication number: 20150077190Abstract: A package structure of crystal oscillator with embedded thermistor is disclosed. The package structure comprises a ceramic substrate. A crystal oscillation device is mounted in the accommodation space of the ceramic substrate. A cover is used to seal the accommodation space. At least one thermistor is embedded in the ceramic substrate. A patterned metal interconnection in the ceramic substrate is electrically connected with the crystal oscillation device and the thermistor, respectively. The present invention describes as follows: the thermistor is directly embedded in the ceramic substrate to avoid the short-circuit problem caused by electroplating a thermistor exposed and shorten a distance between the thermistor and the crystal oscillation device. Thus, the thermistor can more precisely sense the operating temperature of the crystal oscillation device to timely compensate frequency drift caused by changing the temperature of the crystal oscillation device.Type: ApplicationFiled: December 12, 2013Publication date: March 19, 2015Applicant: TXC CORPORATIONInventors: CHIEN-WEI CHIANG, TING YEH
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Publication number: 20150048463Abstract: A package device for a microelectromechanical inertial sensor comprises a ceramic substrate having an upper accommodation space and a lower accommodation and having a plurality of interconnect metal lines thereinside; a microelectromechanical system (MEMS) chip mounted inside the upper accommodation of the ceramic substrate and electrically connected with the interconnect metal lines; a top cover arranged on the ceramic substrate and sealing the upper accommodation space; and an integrated circuit (IC) chip mounted inside the lower accommodation space and electrically connected with the interconnect metal lines. The present invention can improve the reliability of components, increase the yield and decrease the fabrication cost.Type: ApplicationFiled: August 16, 2013Publication date: February 19, 2015Applicant: TXC CORPORATIONInventor: CHIEN-WEI CHIANG