Patents Assigned to Tyco Electronics AMP Guangdong Ltd
  • Publication number: 20240145966
    Abstract: A method for manufacturing an electrically conductive terminal includes steps of plating a nickel plating layer on a surface of the conductive metal base layer, plating a silver plating layer on a surface of the nickel plating layer, and plating a tin plating layer on a surface of the silver plating layer.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 2, 2024
    Applicants: Tyco Electronics AMP Guangdong Ltd, Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Jiaoyong (Mac) Liu, Jialin Zhang, Hongqiang (Sean) Han, Likun Ma
  • Patent number: 11933737
    Abstract: A detection device for detecting a workpiece with multiple surfaces includes a rotary table carrying the workpiece and moving the workpiece by rotation and a plurality of photographing devices arranged at a plurality of different positions around the rotary table. Each photographing device has an image capture device capturing an image of a corresponding surface of the workpiece that is moved to the image capture device. An orientation of the image capture device is defined by a first offset angle and a second offset angle when the image capture device captures the image of the corresponding surface of the workpiece.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: March 19, 2024
    Assignees: Tyco Electronics AMP Guangdong Ltd., TE Connectivity Solutions GmbH, Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Lei (Alex) Zhou, Dandan (Emily) Zhang, Roberto Francisco-Yi Lu, Yanlin Huang, Yangqin Ma, Wei Yang, Guishou Chen, Ming Yang, Yuanyi Zhao
  • Publication number: 20230369809
    Abstract: A connector connection terminal for an electrical connector includes a main body part, a soldering leg and a transition section. The main body part is adapted to be installed inside an insulating housing of the electrical connector. The soldering leg is adapted to be soldered onto a circuit board so as to electrically connect the connection terminal to the circuit board. The soldering leg and the main body part have different widths. The transition section extends from the main body part to the soldering leg such that a width of at least a portion of the transition section is gradually changed.
    Type: Application
    Filed: May 16, 2023
    Publication date: November 16, 2023
    Applicants: Tyco Electronics AMP Guangdong Ltd, TE Connectivity Solutions GmbH, Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Liang (Vincent) Huang, Eric David Briant, Yiyang LU
  • Publication number: 20220373471
    Abstract: A detection device for detecting a workpiece with multiple surfaces includes a rotary table carrying the workpiece and moving the workpiece by rotation and a plurality of photographing devices arranged at a plurality of different positions around the rotary table. Each photographing device has an image capture device capturing an image of a corresponding surface of the workpiece that is moved to the image capture device. An orientation of the image capture device is defined by a first offset angle and a second offset angle when the image capture device captures the image of the corresponding surface of the workpiece.
    Type: Application
    Filed: May 18, 2022
    Publication date: November 24, 2022
    Applicants: Tyco Electronics (Shanghai) Co. Ltd, TE Connectivity Services GmbH, Tyco Electronics AMP Guangdong Ltd
    Inventors: Lei (Alex) Zhou, Dandan (Emily) Zhang, Roberto Francisco-Yi Lu, Yanlin Huang, Yangqin Ma, Wei Yang, Guishou Chen, Ming Yang, Yuanyi Zhao
  • Patent number: 11262140
    Abstract: A heat sink includes a heat sink body having a plurality of stacked fins and a mounting base including a heat dissipation plate. A first surface of the heat dissipation plate is connected to a lower portion of the heat sink body. A protrusion protruding away from the heat sink body is disposed on a portion of a second surface of the heat dissipation plate opposite to the first surface. The protrusion is formed by stamping or bending the heat dissipation plate away from the heat sink body from the first surface of the heat dissipation plate.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: March 1, 2022
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics AMP Guangdong Ltd.
    Inventors: WenYu Liu, Hongqiang Han, Jinsheng Lai, Yan Lee, Lei Liu
  • Publication number: 20200103181
    Abstract: A heat sink includes a heat sink body having a plurality of stacked fins and a mounting base including a heat dissipation plate. A first surface of the heat dissipation plate is connected to a lower portion of the heat sink body. A protrusion protruding away from the heat sink body is disposed on a portion of a second surface of the heat dissipation plate opposite to the first surface. The protrusion is formed by stamping or bending the heat dissipation plate away from the heat sink body from the first surface of the heat dissipation plate.
    Type: Application
    Filed: September 30, 2019
    Publication date: April 2, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics AMP Guangdong Ltd
    Inventors: WenYu Liu, Hongqiang Han, Jinsheng Lai, Yan Lee, Lei Liu