Patents Assigned to Tyco Electronics, Amp, Ltd.
  • Patent number: 6371353
    Abstract: A pressure welding apparatus includes a pressing die assembly 50 which has a plurality of stuffers 54 that pressure-weld electric wires 45 to the pressure-welding parts 34 of contacts 30, and a comb 70. The pressing die assembly 50 has a plurality of pins 60 which are located adjacent to the respective stuffers 54 and which are constantly driven downward by springs 62 so that the pins 60 protrude beyond the lower ends of the stuffers 54. The widths of the respective pins 60 are set so that these widths are substantially equal to the widths of the cavities 16 of the housing 10 in which the contacts 30 are accommodated. As a result, the pins 60 advance into the housing cavities 16 located adjacent to the contact 30 on which pressure-welding is to be performed, and support the housing partition walls 20 from the sides during the pressure welding process.
    Type: Grant
    Filed: March 15, 2000
    Date of Patent: April 16, 2002
    Assignee: Tyco Electronics, Amp, Ltd.
    Inventors: Yuji Ikeda, Koji Imai, Shigeru Isohata, Shinji Amemiya