Patents Assigned to TYCO ELECTRONICS CANADA ULC et al.
  • Patent number: 11156491
    Abstract: A sensor assembly that includes a sealed housing. A printed circuit board assembly including a first section that includes processing circuitry is disposed within the sealed housing and a second section that includes detection circuitry extends from the sealed housing. The sensor assembly also includes a conductive target movably coupled to the second section of the printed circuit board to vary net voltage of the detection circuitry as the conductive target moves along the second section to provide an output signal. The processing circuitry detects the output signal and converts the output signal into a linear representation of position of the conductive target in relation to the second section.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: October 26, 2021
    Assignees: TE CONNECTIVITY CORPORATION, TYCO ELECTRONICS CANADA ULC et al.
    Inventors: Yiyang Liew, Earl Daniel Swope, Christopher Couch, Lucian Iordache, Tobias Becker, Kiranpal Singh, Mathias Michael, Oliver Schaaf