Abstract: A socket connector includes an interconnect assembly having an array of contacts being compressible in a vertical direction and shielding springs surrounding corresponding contacts and being compressible in the vertical direction with the contacts. The shielding springs are electrically grounded and provide electrical shielding for the contacts.

Abstract: An electrical connector system for mounting to a substrate is disclosed. The electrical connector system may include a plurality of wafer assemblies defining a mating end and a mating end. Each wafer assembly may include a first overmolded array of electrical contacts, each electrical contact defining an electrical mating connector extending past an edge of the overmold of the first overmolded array of electrical contacts at the mating end of the wafer assembly; a first ground shield configured to be assembled with the first overmolded array of electrical contacts; and a second overmolded array of electrical contacts configured to be assembled with the first overmolded array of electrical contacts, each electrical contact defining an electrical mating connector extending past an edge of the overmold of the second overmolded array of electrical contacts at the mating end of the wafer assembly.