Patents Assigned to TYCO ELECTRONICS (DONGGUAN) LTD.
  • Publication number: 20240109337
    Abstract: A label printing and attaching system includes a label printing device and a label attaching device. The label printing device has an ink tape supply mechanism for supplying an ink tape with a label pattern. A label tape supply mechanism of the label printing device is adapted to supply a label tape that includes a carrier tape and blank label paper adhered to the carrier tape. The label printing device further includes a heat transfer machine adapted to heat transfer the label pattern on the ink tape onto the blank label paper of the label tape to obtain a desired label. The label attaching device has a label picker adapted to pick up the label with the printed label pattern from the label tape, and a moving device adapted to move the label picker to place the picked label with the printed label pattern onto a product.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 4, 2024
    Applicants: Tyco Electronics (Dongguan) Ltd., TE Connectivity Solutions GmbH, Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Zongjie (Jason) Tao, Hongzhou (Andy) Shen, Dandan (Emily) Zhang, Roberto Francisco-Yi Lu, Guoqiang Liu, Ziqiang Xiong, Kai Fu, Xueyun Zhu, Yi Li, Xuyan Yu
  • Publication number: 20240110776
    Abstract: A detection device adapted to verify or determine a welding quality includes a housing, a moving assembly, a mounting bracket, and a rotating assembly. The moving assembly is movably installed on the housing and is adapted to be moved up and down in a vertical direction. The mounting bracket is fixed to the housing. The rotating assembly includes a rotating member rotatably connected to the mounting bracket and movably connected to the moving assembly, and a contact probe fixed to the rotating member. The contact probe is adapted to make sliding contact with a second component welded on a first component and to push the moving assembly to move in the vertical direction through the rotating member.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 4, 2024
    Applicants: Tyco Electronics (Dongguan) Ltd., TE Connectivity Solutions GmbH, Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Lei (Alex) Zhou, Dandan (Emily) Zhang, Roberto Francisco-Yi Lu, Xuyan Yu, Haoquan Yao, Hongzhou (Andy) Shen, Yi Li
  • Patent number: 11870194
    Abstract: A flag shape contact includes a substrate, and a plug-in structure for receiving a mating contact. The plug-in structure extends from the substrate in a first direction. A riveting structure is provided for riveting or connecting a wire conductor to the contact. The riveting structure extends from the substrate in a second direction, distinct from the first direction. The riveting structure is disposed outside an extension area of the plug-in structure in the first direction.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: January 9, 2024
    Assignees: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics (Dongguan) Ltd.
    Inventors: Jianchou (Jackson) Chen, YuQiang (Thomas) Zhao, Hongbo (Noah) Zhou, Wei Yao, Zhiwei (Will) Liu, Binglin (Aaron) Feng
  • Publication number: 20230364697
    Abstract: A soldering iron head includes a bottom surface, a first side surface, a second side surface opposite to the first side surface, and a positioning slot formed on the bottom surface and extending between the first side surface and the second side surface. The positioning slot is adapted to accommodate and position an exposed end conductor of a cable. The cross section of the positioning slot is trapezoidal in shape, absent a lower bottom. An upper bottom facing side of the trapezoidal cross section of the positioning slot gradually increases in width from the first side surface to the second side surface.
    Type: Application
    Filed: May 10, 2023
    Publication date: November 16, 2023
    Applicants: Tyco Electronics (Dongguan) Ltd., TE Connectivity Solutions GmbH, Tyco Electronics (Shanghai) Co., Ltd., Kunshan League Automechanism Co., Ltd
    Inventors: Zongjie (Jason) Tao, Dandan (Emily) Zhang, Roberto Francisco-Yi Lu, Hongzhou (Andy) Shen, Yun Luo, Haidong Wu
  • Publication number: 20230063718
    Abstract: A cable includes a pair of conductors extending longitudinally and spaced apart from each other, an inner insulating layer circumferentially extending around an outside of the conductors and fixing the conductors, a conductive shielding layer circumferentially extending around an outside of the inner insulating layer, and an insulating sheath extending around an outer peripheral surface of the conductive shielding layer. The insulating sheath is at least one of an extruded layer and a heat shrinkable sleeve.
    Type: Application
    Filed: September 2, 2022
    Publication date: March 2, 2023
    Applicants: Tyco Electronics (Dongguan) Ltd., Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Hainan (Harlan) Lu, Zhiwei (Jack) Guo, Chunjie Ma
  • Publication number: 20220311150
    Abstract: A flag shape contact includes a substrate, and a plug-in structure for receiving a mating contact. The plug-in structure extends from the substrate in a first direction. A riveting structure is provided for riveting or connecting a wire conductor to the contact. The riveting structure extends from the substrate in a second direction, distinct from the first direction. The riveting structure is disposed outside an extension area of the plug-in structure in the first direction.
    Type: Application
    Filed: March 25, 2022
    Publication date: September 29, 2022
    Applicants: Tyco Electronics (Shanghai) Co. Ltd, Tyco Electronics (Dongguan) Ltd.
    Inventors: Jianchou (Jackson) Chen, YuQiang (Thomas) Zhao, Hongbo (Noah) Zhou, Wei Yao, Zhiwei (Will) Liu, Binglin (Aaron) Feng
  • Patent number: 10955363
    Abstract: A soldering quality detection platform comprises a 2D image acquisition device adapted to acquire a 2D image of a soldered region of a soldered product, a 3D image acquisition device adapted to acquire a 3D image of the soldered region of the soldered product, and a judgment device. The judgment device is adapted to determine whether a soldering quality is qualified based on the 2D image and the 3D image of the soldered region of the soldered product.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: March 23, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Ltd., TE Connectivity Corporation
    Inventors: Lei Zhou, Dandan Zhang, Roberto Francisco-Yi Lu, Hongzhou Shen, Jian Zeng
  • Publication number: 20190187070
    Abstract: A soldering quality detection platform comprises a 2D image acquisition device adapted to acquire a 2D image of a soldered region of a soldered product, a 3D image acquisition device adapted to acquire a 3D image of the soldered region of the soldered product, and a judgment device. The judgment device is adapted to determine whether a soldering quality is qualified based on the 2D image and the 3D image of the soldered region of the soldered product.
    Type: Application
    Filed: February 22, 2019
    Publication date: June 20, 2019
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Ltd., TE Connectivity Corporation
    Inventors: Lei Zhou, Dandan Zhang, Roberto Francisco-Yi Lu, Hongzhou Shen, Jian Zeng
  • Patent number: 9997886
    Abstract: A method of forming a terminating end of a cable, comprising the steps of: providing a cable; cutting a circumferential slit through an outer insulation layer; clamping a first section of the outer insulation layer with a first clamping device, and clamping a second section of the outer insulation layer with a second clamping device; displacing the first clamping device, separating the first section from the second section and exposing a section of a metal braid; displacing the first clamping device; pushing and pressing the exposed section to fold the exposed section into a braid protrusion portion; loosening the first and second clamping devices, and removing the cable from the first and second clamping devices; cutting the braid protrusion portion with a cutting device to form a protruding braid portion, the protruding braid portion; and removing the first section of the outer insulation layer and a first protruding braid portion.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: June 12, 2018
    Assignees: TE Connectivity Corporation, Innogetic Technology Co., Ltd., Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Ltd.
    Inventors: Hongzhou Shen, Dandan Zhang, Roberto Francisco-Yi Lu, George J. Dubniczki, Kok Wai Wong
  • Publication number: 20160346858
    Abstract: A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.
    Type: Application
    Filed: August 11, 2016
    Publication date: December 1, 2016
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics Corporation, Tyco Electronics (Dongguan) Ltd
    Inventors: Hongzhou Shen, Dandan Zhang, Roberto Francisco-yi Lu, George J. Dubniczki, Qinglong Zeng
  • Publication number: 20150325970
    Abstract: A method of forming a terminating end of a cable, comprising the steps of: providing a cable; cutting a circumferential slit through an outer insulation layer; clamping a first section of the outer insulation layer with a first clamping device, and clamping a second section of the outer insulation layer with a second clamping device; displacing the first clamping device, separating the first section from the second section and exposing a section of a metal braid; displacing the first clamping device; pushing and pressing the exposed section to fold the exposed section into a braid protrusion portion; loosening the first and second clamping devices, and removing the cable from the first and second clamping devices; cutting the braid protrusion portion with a cutting device to form a protruding braid portion, the protruding braid portion; and removing the first section of the outer insulation layer and a first protruding braid portion.
    Type: Application
    Filed: March 19, 2015
    Publication date: November 12, 2015
    Applicants: TYCO ELECTRONICS (SHANGHAI) CO. LTD., TYCO ELECTRONICS CORPORATION, TYCO ELECTRONICS (DONGGUAN) LTD.
    Inventors: Hongzhou Shen, Dandan Zhang, Roberto Francisco-Lu Yi, George J. Dubniczki, Kok Wai Wong