Abstract: An injection mold insert includes a first metal structure and a second metal structure. The first metal structure has a first hardness and a first thermal conductivity. The second metal structure is wrapped in the first metal structure and has a second hardness less than that of the first hardness, and a second thermal conductivity higher than the first thermal conductivity. The first metal structure and the second metal structure are sintered together without layering or infiltration.
Abstract: An electrical connector has a housing receiving one or more series of electrical contacts. Each series of electrical contacts has a plurality of ground contacts and a plurality of signal contacts. The signal contacts are positioned in between the ground contacts, and the plurality of ground contacts are integrally connected to each other by a bus bar within the housing.
Type:
Grant
Filed:
June 8, 2012
Date of Patent:
March 31, 2015
Assignees:
Tyco Electronics Singapore PTE Ltd., Tyco Electronics Japan G.K.
Abstract: An electrical connector configured to interconnect first and second electrical components. The connector includes a connector housing that is coupled to the first electrical component. The connector housing has a mating face that extends substantially in an axial direction and includes a slot opening. The connector also includes a connector contact that extends through the connector housing and the slot opening. The connector contact has a base portion located a depth within the connector housing and a curved portion formed along and protruding through the slot opening and beyond the mating face. The connector contact is configured to pivot about the base portion when a mating contact of the second electrical component is moved alongside the mating face in the axial direction and engages the curved portion. The curved portion is movable within and along the slot opening in the axial direction.