Abstract: The light-emitting device includes a base plate, a bonding metal layer, a conductive oxide layer, an epitaxial layer, an insulation layer, a first ohmic contact layer, a second ohmic contact layer, a third ohmic contact layer, and a conductor line. The light-emitting device of the present invention uses the process of providing a conductor line to connect an ohmic contact layer, instead of wire bonding, so that a package process required by wire bonding can be eliminated to thereby reduce the size of the light-emitting device. Further, the light-emitting device, after the formation of the conductor line on the ohmic contact layer, allows for performance of a step of directly bonding to a circuit board so as to reduce the package size and simplify equipment necessary for the package process to thereby further lower down fabrication costs, achieving the effects of simplification of operation and fast fabrication.

Abstract: A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. A light extraction layer with a roughened structure is formed on the doped semiconductor layer to improve the light emitting efficiency of LED. Furthermore, the strength of the semiconductor stacked structure can be enhanced by the light extraction layer, to improve the reliability of the LED and the production yields of manufacturing process.

Abstract: A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. An undoped semiconductor layer over the first semiconductor layer may be not removed or not completely removed to increase the strength of the semiconductor stacked structure and improve the reliability of the LED and the production yields of manufacturing process. A roughened structure (or a photonic crystal) can be formed on the undoped semiconductor layer when the semiconductor stacked structure to improve the light emitting efficiency of the LED.

Abstract: A semiconductor device includes a substrate and a semiconductor unit. The substrate includes a base and at least one pattern unit. The pattern unit includes a plurality of surrounding members disposed on the base and a central member surrounded by the surrounding members. A geometrical center is collectively defined by the surrounding members, an interval between the central member and the geometrical center is larger than zero. The semiconductor unit is disposed on the substrate and is operating with a current.

Abstract: An LED lamp includes a lamp base, a heat-dissipating unit, a reflecting unit, a board, and at least one LED mounted on one side of the board facing toward the lamp base. The heat-dissipating unit includes a plurality of heat-dissipating fins disposed spacedly along a periphery of the lamp base. The reflecting unit has a reflector portion and is connected in a thermal-conducting manner to a side of the heat-dissipating fins opposite to the lamp base. The board is connected to the reflecting unit in a manner that the board is spaced apart from the reflector portion, and is formed with at least one light-transmissive portion. The LED has a light exit side facing toward the reflector portion. Light emitted by the LED is reflected by the reflector portion and exits the LED lamp via the light-transmissive portion of the board.

Abstract: A method for adjusting output ratio of an optic sensor includes the following steps: measuring and obtaining a response spectrum of the optic sensor; analyzing optic response ratios of the response spectrum at different wavelengths; designing a ratio of light reception areas of the optic sensor, the design being carried out in accordance with three aspects of “the response spectrum” “a fixed proportional relationship being present between multiplication of the optic response ratio and the light reception area and an output of light current” and “a proportional relationship being present between the light reception area and the output of the light current”; and obtaining light current outputs of identical proportions (such as 1:1:1) or in a desired ratio (meaning any arbitrary ratio other than 1:1:1, such as 1:2:1, 1:2:3, or 3:4:5) in accordance with the design of the previous step.

Abstract: A reflective LED lamp includes a metallic shell, a reflecting member, and an LED unit. The metallic shell includes a surrounding wall formed with a mounting hole unit, and an accommodating space defined by the surrounding wall. The reflecting member is disposed within the accommodating space, and includes a reflection region unit configured as at least one concaved curve surface. The LED unit is disposed within the mounting hole unit in the shell for emitting light onto the reflection region unit of the reflecting member, so that the light is reflected by the reflection region unit out of the shell.

Abstract: An alternating current light-emitting device includes a substrate, an alternating current microdie light-emitting module, and a conductive structure. The alternating current microdie light-emitting module is formed on the substrate and has at least two microdies and a concave portion disposed between the two microdies. Each of the microdies has at least one active layer. The conductive structure electrically connects the microdies and thereby enables the active layers of the microdies to take turns to emit light during positive and negative half cycles of alternating current. The conductive structure is formed in the concave portion and covers an insulator. The present invention prevents undue open circuits but enhances yield.

Abstract: A submount holder for flip chip packaging of light emitting diode (LED) includes a substrate on which a body is formed. The submount body defines a cavity sized and shaped to snugly receive an LED die therein. The cavity precisely retains the die in position and prevents the die from arbitrary movement during a packaging and wiring process. First and second connection sections are formed on opposite sides of the cavity and respectively connected to the cavity by a channel. A conductively layer is formed on the substrate in the cavity, the first and second connection sections and the channels connecting the connection sections and the cavity. A groove is defined in the body and extends through the cavity with the connection sections located on opposite sides of the groove. The conductive layer is divided by the groove into separated and isolated portions.