Abstract: A light-emitting diode (LED) package including a carrier, a pair of conductive wire units, an LED chip, and a control circuit module is provided. The carrier has a carrying portion and a ring frame connected to the periphery of the carrying portion. The carrying portion has a dome-like upper surface and a pair of through holes. The pair of conductive wire units is disposed inside the through holes respectively, and each of the conductive wire units has a conductive wire and an insulating material encapsulating the conductive wire. The LED chip is disposed on the upper surface of the carrier and is electrically connected to the conductive wires. The control circuit module is disposed at a bottom of the carrier and is electrically connected to the conductive wires for controlling the operation of the LED chip.

Abstract: A light-emitting device of a light-emitting diode (LED) and a manufacture method thereof are provided. The light-emitting device includes a post-like metal material, a printed circuit board, conductors, insulators, light-emitting diodes, wires, and an encapsulating material. The light-emitting device has through holes, in which conductors are disposed and surrounded with the insulators. One end of each conductor is connected to the printed circuit board to form a composite structure heat-dissipation substrate. The light-emitting diodes are disposed on the post-like metal material, connected to the conductors via the wires, and encapsulated by the encapsulating material. Furthermore, the light-emitting diodes, the wires, and the encapsulating material can be combined into a light-emitting unit. Moreover, red, blue, and green light-emitting diodes can be combined and the color of output light thereof can be adjusted by controlling the input signal.

Abstract: A light-emitting diode (LED) package including a carrier, a pair of conductive wire units, an LED chip, and a control circuit module is provided. The carrier has a carrying portion and a ring frame connected to the periphery of the carrying portion. The carrying portion has a dome-like upper surface and a pair of through holes. The pair of conductive wire units is disposed inside the through holes respectively, and each of the conductive wire units has a conductive wire and an insulating material encapsulating the conductive wire. The LED chip is disposed on the upper surface of the carrier and is electrically connected to the conductive wires. The control circuit module is disposed at a bottom of the carrier and is electrically connected to the conductive wires for controlling the operation of the LED chip.

Abstract: A light emitting diode (LED) package including a heat dissipation base, an electrical insulating layer, a circuit layer, and an LED chip is provided. The electrical insulating layer is disposed on the heat dissipation base. The circuit layer is disposed on the electrical insulating layer. The circuit layer has a receiving hole extending and passing through the electrical insulating layer for exposing a portion of the heat dissipation base. The LED chip is disposed on the heat dissipation base exposed by the receiving hole and is electrically connected to the circuit layer.

Abstract: A light emitting diode (LED) lamp including a substrate, a plurality of wire units, a plurality of LED chips, a lamp cap, and a control circuit module is provided. The substrate has a carrying portion and a ring frame connected to the periphery thereof. The carrying portion has a plurality of openings. The wire units are respectively disposed inside the openings. Each wire unit has a wire and an insulating material covering the periphery of the wire, such that the wire is electrically isolated from the substrate. The LED chips are disposed on the carrying portion, and each LED chip is electrically connected to the corresponding wires. The lamp, cap is disposed on the bottom of the substrate and has two power contacts. The control circuit module is disposed between the substrate and the lamp cap and electrically connected to wires and power contacts, to control operations of LED chips.

Abstract: A heat dissipation module including a substrate, a printed circuit board (PCB), and at least one light emitting diode (LED) chip is provided. A surface of the substrate has at least one positioning portion protruding upward. The PCB has at least one positioning hole corresponding to the positioning part. The PCB is disposed on the surface of the substrate, such that the positioning part is located in the positioning hole. The LED chip is disposed on the positioning part and electrically connected to the PCB.