Abstract: A personal audio unit, PAU, is described. The PAU comprises: a shell forming a cavity within the shell; an electronics module located within the cavity; wherein the cavity includes a solidified encapsulant contacting at least a portion of the electronics module and an internal wall of the shell. A method of manufacturing a personal audio unit, PAU, is described. The method including the steps of: forming a shell, the shell forming a cavity therein, the shell having a filling port into the cavity; locating an electronics module within the cavity; introducing a liquid encapsulant into the cavity via the filling port such that the liquid encapsulant enters interstices between the electronics module and an internal surface of the shell, and; curing the liquid encapsulant to form a solid encapsulant.

Abstract: A personal audio unit, PAU, is described. The PAU comprises: a shell forming a cavity within the shell; an electronics module located within the cavity; wherein the cavity includes a solidified encapsulant contacting at least a portion of the electronics module and an internal wall of the shell. A method of manufacturing a personal audio unit, PAU, is described. The method including the steps of: forming a shell, the shell forming a cavity therein, the shell having a filling port into the cavity; locating an electronics module within the cavity; introducing a liquid encapsulant into the cavity via the filling port such that the liquid encapsulant enters interstices between the electronics module and an internal surface of the shell, and; curing the liquid encapsulant to form a solid encapsulant.

Abstract: A personal audio unit, PAU, is described. The PAU comprises: a shell forming a cavity within the shell; an electronics module located within the cavity; wherein the cavity includes a solidified encapsulant contacting at least a portion of the electronics module and an internal wall of the shell. A method of manufacturing a personal audio unit, PAU, is described. The method including the steps of: forming a shell, the shell forming a cavity therein, the shell having a filling port into the cavity; locating an electronics module within the cavity; introducing a liquid encapsulant into the cavity via the filling port such that the liquid encapsulant enters interstices between the electronics module and an internal surface of the shell, and; curing the liquid encapsulant to form a solid encapsulant.