Abstract: The present invention is directed to an article of manufacture that includes an RFID inlay having a programmable integrated circuit coupled to a propagation element on a first side of a rigid two-sided printed circuit board. The programmable integrated circuit is covered by a protective material having at least one material characteristic, whereby the programmable integrated circuit is hardened to withstand a predetermined applied pressure and a predetermined ambient temperature. At least one molded exterior portion encapsulates the RFID inlay. The at least one molded exterior portion is formed by an injection molding process characterized by a molding pressure that is lower than the predetermined applied pressure and a molding temperature lower than the predetermined ambient pressure, whereby the RFID inlay is not accessible without destroying the article of manufacture.