Patents Assigned to Uchihashi Estec Co., Ltd.
  • Patent number: 11673214
    Abstract: A lead-free solder contains 93.0 mass % or more and 98.95 mass % or less of indium, 1.0 mass % or more and 4.0 mass % or less of tin, and an addition metal. The addition metal contains at least one of silver, antimony, copper, or nickel. The addition metal is neither indium nor tin. The total of mass percentage of the addition metal is 0.05 mass % or more and 6.0 mass % or less. The sum of the total mass percentage of the addition metal, the mass percentage of indium, and the mass percentage of tin is 100 mass % or less.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: June 13, 2023
    Assignee: Uchihashi Estec Co., Ltd.
    Inventors: Yoshihiro Yoshioka, Kazuo Inada, Tomokuni Mitsui, Hitoshi Yamanaka
  • Publication number: 20220379411
    Abstract: A lead-free solder contains 93.0 mass % or more and 98.95 mass % or less of indium, 1.0 mass % or more and 4.0 mass % or less of tin, and an addition metal. The addition metal contains at least one of silver, antimony, copper, or nickel. The addition metal is neither indium nor tin. The total of mass percentage of the addition metal is 0.05 mass % or more and 6.0 mass % or less. The sum of the total mass percentage of the addition metal, the mass percentage of indium, and the mass percentage of tin is 100 mass % or less.
    Type: Application
    Filed: May 25, 2022
    Publication date: December 1, 2022
    Applicant: Uchihashi Estec Co., Ltd.
    Inventors: Yoshihiro YOSHIOKA, Kazuo INADA, Tomokuni MITSUI, Hitoshi YAMANAKA
  • Publication number: 20180040443
    Abstract: The object of the present invention is to provide a protection device capable of sufficiently suppressing the occurrence of arc at the time of activation with large rated voltage and rated current, as well as capable of fully opening the circuit. The present invention provides a protection device comprising: (i) a protection component comprising a first thermal fuse and a resistive body, the resistive body being supplied with a current in an abnormal state to generate heat, the heat activating the first thermal fuse to cut off the current; (ii) a PTC component; and (iii) a second thermal fuse, the second thermal fuse being electrically connected in series to the PTC component, the first thermal fuse of the protection component being electrically connected in parallel to the PTC component and to the second thermal fuse, and the protection component being activated in the abnormal state so that the PTC component trips to generate heat, the heat blowing the second thermal fuse.
    Type: Application
    Filed: July 1, 2014
    Publication date: February 8, 2018
    Applicants: Tyco Electronics Japan G.K., Uchihashi Estec Co., Ltd.
    Inventors: Takayuki Yokota, Masaaki Iwai, Hirotsugu Takegawa, Naotaka Ikawa
  • Publication number: 20140138155
    Abstract: A glazing is disclosed comprising at least one ply of glass having an electrically conductive component on at least one surface, and an electrical connector electrically connected to the electrically conductive component through a soldered joint, the solder of the joint having a composition comprising 0.5 wt % or more indium, wherein the electrical connector comprises a nickel plated contact for contacting the solder. Also disclosed are solders having a composition comprising 14 to 75 wt % In, 14 to 75 wt % Sn, to 5 wt % Ag, to 5 wt % Ni, and less than 0.1 wt % Pb. Also disclosed is use of a solder having a composition comprising 0.5 wt % or more indium to solder a nickel plated electrical connector to an electrically conductive component on the surface of a ply of glass. The aspects of the invention improve the durability of electrical connections on glazing.
    Type: Application
    Filed: May 2, 2012
    Publication date: May 22, 2014
    Applicants: PILKINGTON GROUP LIMITED, NIPPON SHEET GLASS CO., LTD., UCHIHASHI ESTEC CO., LTD., NISHINIHON SHOKO CO., LTD
    Inventors: Michael Lyon, Naotaka Ikawa, Kazuo Inada, Mamoru Yoshida, Takashi Muromachi, Kazuhisa Ono, Kozo Okamoto, Takashi Suzuki
  • Patent number: 7385474
    Abstract: In the thermosensor of the invention, both ends 21, 22 of an elastic member 2 are fixed to a body 1 in a state where the elastic member 2 is compressed in a longitudinal direction, to form the elastic member 2 into a convex curved shape, one end side of the convex curved shape is raised by a predetermined angle ?L? with respect to the body 1, a flexure angle of another end 22 of the convex curved shape is zero, the fixation of one end portion 21 of the elastic member 2 and the body 1 is conducted via a fusible material 3, and a melting point or a softening point of the fusible material 3 is an operating temperature.
    Type: Grant
    Filed: August 2, 2005
    Date of Patent: June 10, 2008
    Assignee: Uchihashi Estec Co., Ltd.
    Inventor: Toshiro Kawanishi
  • Patent number: 7345570
    Abstract: In the thermoprotector of the invention, an elastic movable conductor 3 is placed between stationary electrodes 21, 22 opposed in an insulation housing 1. One end of the elastic movable conductor 3 is fixed to one stationary electrode 21. The elastic movable conductor 3 is compressed in a longitudinal direction and elastically curved to cause a middle of the elastic movable conductor 3 to be contacted with the other stationary electrode 22. Another end portion of the elastic movable conductor 3 is face joined by a fusible material 4 to the one stationary electrode 21 against a reaction force of the longitudinal direction compression. An insulation spacer 5 is disposed in the insulation housing 1. The insulation spacer forms a space for housing the other end portion of the elastic movable conductor 3 when the elastic movable conductor 3 is elastically released by melting of the fusible material 4.
    Type: Grant
    Filed: August 2, 2005
    Date of Patent: March 18, 2008
    Assignee: Uchihashi Estec Co., Ltd.
    Inventor: Toshiro Kawanishi
  • Publication number: 20070188292
    Abstract: An alloy type thermal fuse is provided in which, although a fuse element essentially comprising an In-Sn alloy is used, shear breakage at the melting point or lower can be prevented from occurring even under long-term DC application, the operation stability to a heat cycle can be satisfactorily assured, and a process of drawing to the fuse element at a high yield can be ensured, and which has an operating temperature belonging to the range of 120 to 150° C. As a metal element for preventing long-term DC breakage which prevents the fuse element from being broken under long-term DC application, Cu is added to an In-Sn composition of 52 to 85% In and a balance Sn.
    Type: Application
    Filed: March 27, 2007
    Publication date: August 16, 2007
    Applicant: UCHIHASHI ESTEC CO., LTD.
    Inventors: Miki IWAMOTO, Naotaka IKAWA, Toshiaki SARUWATARI, Yoshiaki TANAKA
  • Patent number: 7199697
    Abstract: An alloy type thermal fuse is provided in which a ternary Sn—In—Bi alloy is used, excellent overload characteristic and dielectric breakdown characteristic are attained, the insulation stability after an operation can be sufficiently assured, and a fuse element can be easily thinned. A fuse element having an alloy composition in which Sn is larger than 25% and 60% or smaller, Bi is larger than 12% and 33% or smaller, and In is 20% or larger and smaller than 50% is used.
    Type: Grant
    Filed: September 4, 2003
    Date of Patent: April 3, 2007
    Assignee: Uchihashi Estec Co., Ltd.
    Inventor: Yoshiaki Tanaka
  • Patent number: 7160504
    Abstract: The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type. The fuse element has an alloy composition in which a total of 0.01 to 7 weight parts of at least one selected from the group consisting of Au, Bi, Cu, Ni, and Pd is added to 100 weight parts of a composition of 100% In, that of 90 to 99.9% In and 0.1 to 10% Ag, or that of 95 to 99.9% In and 0.1 to 5% Sb. As a result, the operating temperature is in the range of 135 to 160° C., requests for environment conservation can be satisfied, the diameter of the fuse element can be made very thin or reduced to about 300 ?m?, and the thermal stability can be satisfactorily guaranteed.
    Type: Grant
    Filed: March 4, 2003
    Date of Patent: January 9, 2007
    Assignee: Uchihashi Estec Co., Ltd.
    Inventor: Yoshiaki Tanaka
  • Patent number: 7064648
    Abstract: An alloy type thermal fuse is provided in which a Bi—Sn alloy is used as a fuse element, which has an operating temperature of about 140° C., which, even when used at a high power, can safely operate, and in which dispersion of the operating temperature can be sufficiently reduced. Also a material for a thermal fuse element is provided. An alloy composition in which Bi is larger than 50% and 56% or smaller, and a balance is Sn is used as a fuse element of the alloy type thermal fuse.
    Type: Grant
    Filed: September 4, 2003
    Date of Patent: June 20, 2006
    Assignee: Uchihashi Estec Co., Ltd.
    Inventor: Yoshiaki Tanaka
  • Patent number: 7042327
    Abstract: An alloy type thermal fuse is provided in which a ternary Sn—In—Bi alloy is used, the operating temperature belongs to the range of 130 to 170° C., the overload characteristic and the dielectric breakdown characteristic are excellent, the insulation stability after an operation can be sufficiently ensured, and thinning of a fuse element can be easily realized. A fuse element having an alloy composition in which Sn is larger than 43% and 70% or smaller, In is 0.5% or higher and 10% or lower, and a balance is Bi is used.
    Type: Grant
    Filed: September 3, 2003
    Date of Patent: May 9, 2006
    Assignee: Uchihashi Estec Co., Ltd.
    Inventors: Yoshiaki Tanaka, Toshiaki Saruwatari
  • Patent number: 7038569
    Abstract: The present invention relates to an alloy type thermal fuse and a fuse element which are particularly useful as a thermoprotector for a battery. It is an object of the invention to provide an alloy type thermal fuse in which a ternary In—Sn—Bi alloy or an alloy in which Ag or Cu is added to the ternary alloy is used as a fuse element, or the fuse element wherein dispersion of the operating temperature can be satisfactorily suppressed, the operating temperature can be set to about 100° C. or lower, and the specific resistance and the mechanical strength of the fuse element can be sufficiently ensured. A low-melting fusible alloy serving as the fuse element has an alloy composition of 50 to 55% In, 25 to 40% Sn, and balance Bi. In a preferable range of the composition, In is 51 to 53%, Sn is 32 to 36%, and a balance is Bi.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: May 2, 2006
    Assignee: Uchihashi Estec Co., Ltd.
    Inventor: Yoshihito Hamada
  • Patent number: 6963264
    Abstract: The invention relates to an alloy type thermal fuse and a wire member for a thermal fuse element, and provides an alloy type thermal fuse in which a fuse element does not contain a harmful metal, the operating temperature is about 150° C., the dispersion of the operating temperature can be sufficiently suppressed, and the operation stability to a heat cycle can be satisfactorily assured. The thermal fuse has an alloy composition of 30 to 70% Sn, 0.3 to 20% Sb, and a balance Bi.
    Type: Grant
    Filed: June 27, 2003
    Date of Patent: November 8, 2005
    Assignee: Uchihashi Estec Co., Ltd.
    Inventors: Miki Iwamoto, Naotaka Ikawa, Toshiaki Saruwatari, Yoshiaki Tanaka
  • Patent number: 6911892
    Abstract: The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type in which the fuse element has an alloy composition of 37 to 43% In, 10 to 18% Sn, and the balance Bi. As a result, the operating temperature is in the range of 65 to 75° C., requests for environment conservation can be satisfied, the diameter of the fuse element can be made very thin or reduced to about 300 ?m?, self-heating can be suppressed, and the thermal stability can be satisfactorily guaranteed.
    Type: Grant
    Filed: August 3, 2004
    Date of Patent: June 28, 2005
    Assignee: Uchihashi Estec Co., Ltd.
    Inventor: Yoshiaki Tanaka
  • Patent number: 6841845
    Abstract: An alloy type thermal fuse is provided in which, although a fuse element essentially comprising an In-Sn alloy is used, the operation stability to a heat cycle can be satisfactorily assured, and, even when the amount of In is large, a process of drawing to the fuse element at a high yield can be ensured, and which has an operating temperature belonging to the range of 120 to 150° C. The fuse element has an alloy composition in which 0.1 to 7 weight parts of one, or two or more metals selected from the group consisting of Ag, Au, Cu, Ni, Pd, Pt, and Sb are added to 100 weight parts of an alloy of 52 to 85% In and a balance Sn.
    Type: Grant
    Filed: July 8, 2003
    Date of Patent: January 11, 2005
    Assignee: Uchihashi Estec Co., Ltd.
    Inventors: Miki Iwamoto, Naotaka Ikawa, Toshiaki Saruwatari, Yoshiaki Tanaka
  • Patent number: 6819215
    Abstract: The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type in which the fuse element has an alloy composition of 37 to 43% In, 10 to 18% Sn, and the balance Bi. As a result, the operating temperature is in the range of 65 to 75° C., requests for environment conservation can be satisfied, the diameter of the fuse element can be made very thin or reduced to about 300 &mgr;m&phgr;, self-heating can be suppressed, and the thermal stability can be satisfactorily guaranteed.
    Type: Grant
    Filed: March 4, 2003
    Date of Patent: November 16, 2004
    Assignee: Uchihashi Estec Co., Ltd.
    Inventor: Yoshiaki Tanaka
  • Publication number: 20040196133
    Abstract: A thin thermal fuse is provided with a rush current resistance performance so as to be usable also as a current fuse. In a thermal fuse in which a low-melting fusible alloy piece 2 having an alloy composition containing 40 to 70% Bi is connected between a pair of flat lead conductors 1, 1, a flux 4 is applied to the low-melting fusible alloy piece 2, and the piece is sandwiched between a resin base film 31 and a resin cover film 32 to provide insulation, the resistance of the low-melting fusible alloy piece 2 is set so as to enable the low-melting fusible alloy piece 2 to be fused off also by Joule heat due to an allowable maximum current of a secondary battery.
    Type: Application
    Filed: March 22, 2004
    Publication date: October 7, 2004
    Applicant: Uchihashi Estec Co., Ltd.
    Inventor: Toshiro Kawanishi
  • Publication number: 20040184947
    Abstract: An alloy type thermal fuse of an operating temperature of 75 to 120° C. is provided in which a fuse element of a Bi—In—Sn alloy is used, excellent aging and heat cycle resistances for a long term can be ensured, and satisfactory operating characteristic can be ensured.
    Type: Application
    Filed: September 4, 2003
    Publication date: September 23, 2004
    Applicant: Uchihashi Estec Co., Ltd.
    Inventor: Yoshiaki Tanaka
  • Publication number: 20040174243
    Abstract: An alloy type thermal fuse is provided in which a Bi—Sn alloy is used as a fuse element, which has an operating temperature of about 140° C., which, even when used at a high power, can safely operate, and in which dispersion of the operating temperature can be sufficiently reduced. Also a material for a thermal fuse element is provided.
    Type: Application
    Filed: September 4, 2003
    Publication date: September 9, 2004
    Applicant: Uchihashi Estec Co., Ltd.
    Inventor: Yoshiaki Tanaka
  • Patent number: 6774761
    Abstract: The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type in which the fuse element has an alloy composition of 48 to 60% In, 10 to 25% Sn, and the balance Bi, and a total of 0.01 to 7 weight parts of at least one selected from the group consisting of Au, Ag, Cu, Ni, and Pd is added to 100 weight parts of the composition. As a result, the operating temperature is in the range of 57 to 67° C., requests for environment conservation can be satisfied, the diameter of the fuse element can be made very thin or reduced to about 300 &mgr;m&phgr;, self-heating can be suppressed, and the thermal stability can be satisfactorily guaranteed.
    Type: Grant
    Filed: March 4, 2003
    Date of Patent: August 10, 2004
    Assignee: Uchihashi Estec Co., Ltd.
    Inventor: Yoshiaki Tanaka