Abstract: A processing apparatus for an electronic component includes a component holding portion that holds an electronic component, a support portion that supports the component holding portion such that the component holding portion is located on a circular orbit passing through a predetermined inspection position, a transport drive unit that rotates the support portion about a central axis of the circular orbit, an imaging unit that is configured to image an inspection surface of the electronic component held by the component holding portion disposed at the inspection position, a position sensor that acquires position information indicating a position of the inspection surface, and a focus adjustment unit that adjusts a focus of the imaging unit on the inspection surface.

Abstract: A processing apparatus for an electronic component includes a component holder configured to hold the electronic component, a turning unit configured to hold the component holder toward an outside of a predetermined circular track, a turning drive unit configured to turn the turning unit around a first axis along a central axis of the circular track, and a rotation drive unit provided on the turning unit and configured to rotate the component holder around a second axis along a radial direction of the circular track.

Abstract: A processing apparatus for an electronic component includes a component holder configured to hold the electronic component, a turning unit configured to hold the component holder toward an outside of a predetermined circular track, a turning drive unit configured to turn the turning unit around a first axis along a central axis of the circular track, and a rotation drive unit provided on the turning unit and configured to rotate the component holder around a second axis along a radial direction of the circular track.

Abstract: An processing apparatus includes a first illumination portion and a first imaging portion. The first illumination portion irradiates ta second inner surface on an opposite side of a second outer surface and a third inner surface on an opposite side of a third outer surface via a first outer surface of the electronic component with irradiation light in a state where the electronic component is disposed on a first inspection position. The first imaging portion captures an image of a first internal corner portion formed by the second inner surface and the third inner surface, based on the first irradiation light emitted from the first outer surface after being specularly reflected on the second inner surface and the third inner surface.

Abstract: An processing apparatus includes a first illumination portion and a first imaging portion. The first illumination portion irradiates ta second inner surface on an opposite side of a second outer surface and a third inner surface on an opposite side of a third outer surface via a first outer surface of the electronic component with irradiation light in a state where the electronic component is disposed on a first inspection position. The first imaging portion captures an image of a first internal corner portion formed by the second inner surface and the third inner surface, based on the first irradiation light emitted from the first outer surface after being specularly reflected on the second inner surface and the third inner surface.

Abstract: This apparatus includes a carrying path for an electronic component, a holder unit holding and releasing the electronic component, and N number of rotary pickups including the multiple holder units, and intermittently rotating around the rotation axis. At least one of the rotary pickups is a first carrying structure. The rotary pickup adjacent to the first carrying structure is a second carrying structure installed so as to not overlap with each other, to have the respective rotation axes orthogonal to each other. The holder unit of the first carrying structure and that of the second carrying structure are each a sucking nozzle. The holder units of the first carrying structure and of the second carrying structure have a common stop position, and the electronic component is transferred at only a transfer point that is the stop position.

Abstract: A visual inspection apparatus 10 performing a visual inspection of an electronic component 13 including opposing sides 11, 11a and opposing sides 12, 12a, the apparatus 10 including an optical-path adjusting means 30 changing a traveling direction of a light and setting an appearance of the side 11a of the electronic component 13 temporarily stopped at a first inspection point in an image of the side 11 of the electronic component 13 captured by a first imaging means 31, and an optical-path adjusting means 34 setting an appearance of the side 12a of the electronic component 13 temporarily stopped at a second inspection point in an image of the side 12 of the electronic component 13 captured by a second imaging means 35, thereby performing a visual inspection of the sides 11, 11a, 12, 12a.

Abstract: A visual inspection apparatus 10 performing a visual inspection of an electronic component 13 including opposing sides 11, 11a and opposing sides 12, 12a, the apparatus 10 including an optical-path adjusting means 30 changing a traveling direction of a light and setting an appearance of the side 11a of the electronic component 13 temporarily stopped at a first inspection point in an image of the side 11 of the electronic component 13 captured by a first imaging means 31, and an optical-path adjusting means 34 setting an appearance of the side 12a of the electronic component 13 temporarily stopped at a second inspection point in an image of the side 12 of the electronic component 13 captured by a second imaging means 35, thereby performing a visual inspection of the sides 11, 11a, 12, 12a.