Abstract: Disclosed herein is a method for transferring die from a wafer that includes picking two or more die from a wafer using a multi-spindle picking head, wherein the multi-spindle picking head is rotatable. The method includes moving the multi-spindle picking head from the wafer feeder to a placement machine, and presenting the two or more picked die to the placement machine for subsequent placement. Further disclosed herein is an apparatus for transferring die from a wafer that includes a picking head with a plurality of spindles. Each spindle is configured to pick a die from a wafer of die. The multi-spindle picking head is rotatable and moveable in at least one direction.

Abstract: A pick and place head for a pick and place machine includes a stationary frame; a first circuit board mounted on the stationary frame, the first circuit board including a first plurality of electric circuits; a rotating frame rotatably mounted to the stationary frame; a plurality of spindle assemblies mounted one the rotating frame, each of the plurality of spindle assemblies including a set of electric contacts; a second circuit board mounted on the rotating frame, the second circuit board including a second plurality of electric circuits; a slip ring assembly mounted between the first circuit board and the second circuit board; the slip ring assembly including a first portion and a second portion; the first portion of the slip ring assembly being rotatable relative to the second portion of the slip ring assembly, and the slip ring assembly further including a set of electrical connectors that enable the first plurality of electric circuits to maintain electrical connection with the second plurality of elect

Abstract: In recapitulation, the present invention is a method and apparatus for the reliable removal and installation of a component feeding system, such as a direct die feeder, within a printed circuit board or similar assembly machine such as those used in the assembly of printed circuit boards. The invention employs a docking channel operatively affixed to the assembly machine, where the docking channel includes at least a pair of parallel grooves into which alignment rails on the component feeder may be inserted. In this way, the position of the component feeder may be controlled. The docking channel may further include stops, safety locks, alignment pins and a transport device to facilitate easy removal and exchange of component feeders on an assembly machine.