Patents Assigned to ULDTEC CO., LTD.
  • Patent number: 12622323
    Abstract: A liquid-droplet-like ink containing a plurality of vertical semiconductor light emitting element chips 40, each of which has a p-side electrode and an n-side electrode on the upper surface and the lower surface and is configured such that one of the p-side electrode and the n-side electrode is more strongly attracted to a magnetic field than the other is supplied to a chip joining part 421 on a lower electrode 420 on a mounting substrate 400, the semiconductor light emitting element chips 40 in the ink are joined to the chip joining part by applying an external magnetic field such that one of the p-side electrode and the n-side electrode faces to the chip joining part, and thereafter an upper electrode 430 having an upper electrode main line part 431 and a plurality of upper electrode branch line parts 432 which are connected by a thin film fuse 433 each other is formed as the upper layer of the semiconductor light emitting element chips 40 such that the other of the p-side electrode and the n-side electrode
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: May 5, 2026
    Assignee: ULDTEC CO., LTD.
    Inventor: Motonobu Takeya
  • Patent number: 12176463
    Abstract: A liquid-droplet-like semiconductor chip ink 200 contains a liquid 50 and semiconductor chips 40, each of which has a first electrode and a second electrod on the upper surface and the lower surface and is configured such that the second electrode side is more strongly attracted to a magnetic field. The semiconductor chip ink 200 is supplied to a chip joining part on a lower electrode 420 which is formed on a mounting substrate 400, the second electrode side of the semiconductor chips 40 in the semiconductor chip ink 200 are attracted by a magnetic force by an external magnetic field so as to make contact with the chip joining part, and thereafter is electrically and mechanically joined to the chip joining part by using soldering and the like.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: December 24, 2024
    Assignee: ULDTEC CO., LTD.
    Inventor: Motonobu Takeya