Abstract: An electrical connector is provided which has a male contact and a female contact movable between an uninserted configuration and an inserted configuration, wherein the male contact is inserted along an axis of insertion into a housing of the female contact. The female contact includes a body, a plurality of blades, and a protective system that has an insulating jacket surrounding the blades, an insulating component movable in axial translation with respect to the body between a rest position, wherein the insulating component at least partially closes the housing and abuts axially against the female contact, and a pushed-in position, wherein the insulating component is pushed towards the bottom of the housing by the male contact, and a mechanism for returning the insulating component to the rest position.

Abstract: Disclosed is an electrical connector including: a first contact, and a second contact; a first sleeve and a second sleeve forming a box in a connected configuration of the connector around a contact zone; the first sleeve including a first radially outer wall for electrically connecting to a shielding braid of the first electrical cable, and a first radially inner wall electrically connected to the first contact, and a first electrically insulating medium; the second sleeve including a second radially outer wall, a second radially inner wall, and a second electrically insulating medium; the first radially outer wall and the second radially outer wall form, in the connected configuration, a continuous outer surface of the housing, the first radially inner wall and the second radially inner wall forming a continuous inner surface.

Abstract: An assembly (10) includes a first connector (12), and a second connector (14) mobile in axial translation relative to the first connector, a first part (16) attached to the first connector, and a first sleeve (18) axially rotatable relative to the first part between a first plurality of positions, a first blocking device (20) blocking the first sleeve, a second part (22) attached to the second connector, and a second sleeve (24) axially rotatable relative to the second part between a second plurality of positions, a second blocking device (26) blocking the second sleeve. The first sleeve, the first part, the second sleeve, and the second part have shapes that provide a coding that allows connection only if the position of the first sleeve matches the position of the second sleeve.

Abstract: An assembly (10) includes a first connector (12), and a second connector (14) mobile in axial translation relative to the first connector, a first part (16) attached to the first connector, and a first sleeve (18) axially rotatable relative to the first part between a first plurality of positions, a first blocking device (20) blocking the first sleeve, a second part (22) attached to the second connector, and a second sleeve (24) axially rotatable relative to the second part between a second plurality of positions, a second blocking device (26) blocking the second sleeve. The first sleeve, the first part, the second sleeve, and the second part have shapes that provide a coding that allows connection only if the position of the first sleeve matches the position of the second sleeve.

Abstract: Systems and methods are disclosed for performing laser annealing in a manner that reduces or minimizes wafer surface temperature variations during the laser annealing process. The systems and methods include annealing the wafer surface with first and second laser beams that represent preheat and anneal laser beams having respective first and second intensities. The preheat laser beam brings the wafer surface temperate close to the annealing temperature and the anneal laser beam brings the wafer surface temperature up to the annealing temperature. The anneal laser beam can have a different wavelength, or the same wavelength but different orientation relative to the wafer surface. Reflectivity maps of the wafer surface at the preheat and anneal wavelengths are measured and used to select the first and second intensities that ensure good anneal temperature uniformity as a function of wafer position. The first and second intensities can also be selected to minimize edge damage or slip generation.