Patents Assigned to UMCI Ltd.
  • Method of processing semiconductor wafer
    Patent number: 7142940
    Abstract: A method of processing a semiconductor wafer is provided. The semiconductor wafer is processed with a first process. After collecting the measured data that reflects the deviation of each part within the semiconductor wafer, the semiconductor wafer is processed with a second process according to the measured data to compensate the deviation from the first process and to correct any deviation in the semiconductor wafer.
    Type: Grant
    Filed: March 14, 2005
    Date of Patent: November 28, 2006
    Assignee: UMCI Ltd.
    Inventors: Hong Ma, Meisheng Zhou