Abstract: An automatic accurate alignment method for a wafer cutting apparatus includes: (a) placing a wafer on a platform, and moving the platform and a camera unit to initial positions; (b) matching the electrical output of the camera unit with a key pattern to find a plurality of adjacent working patterns, and recording center point coordinates of the working patterns; (c) calculating at least one distance value associated with the center point coordinates of a corresponding adjacent pair of the working patterns; (d) determining whether any one calculated distance value complies with a key pattern dimension; and (e) upon determination that there is one calculated distance value that complies with the key pattern dimension, rotating the platform so that an imaginary line interconnecting the center point coordinates that are associated with the determined distance value is disposed parallel to a predetermined wafer cutting direction.

Abstract: A method of producing individual integrated circuit package units includes the steps of: providing a base which includes a leadframe, a plurality of package precursors, and a continuous encapsulating epoxy layer bonded integrally with the leadframe; and singulating the package precursors. The leadframe has a plurality of metallic connection bars and extension parts formed integrally with the connection bars. The package precursors are singulated by cutting the leadframe and the epoxy layer along first and second cutting streets. The cutting of the base is performed by cutting into the first and second cutting streets with a cutting tool, which can be a single-blade or dual-blade, thereby separating the connection bars from the inner leads.

Abstract: A device for cutting a row of interconnected rectangular plate-shaped workpieces into a plurality of individual rectangular units, includes a machine bed, and a sliding member disposed slidably on the machine bed and movable along a straight path. A rectangular work seat is disposed rotatably on the sliding member, and is rotatable about a vertical axis on the sliding member. The work seat has four sides, a length and a width. A mounting frame is disposed around the work seat, and defines a rectangular hole therein, which has four sides that are respectively parallel to the four sides of the work seat, and a length and a width that are respectively and slightly larger than those of the work seat. An adhesive sheet has an adhesive top surface with an outer peripheral portion that is adhered to a bottom surface of the mounting frame. The interconnected workpieces are adhered to the top surface of the adhesive sheet so as to be cut while disposed inside the mounting frame.

Abstract: A singulation system for a BGA product is disclosed, which has a cutting mechanism with a cutting head, a conveyor belt arranged under the cutting head, a cutting table positioned to connect with the conveyor belt, a cleaning station positioned beside the cutting mechanism, a loading frame capable of moving up and down and positioned beside the cleaning station, a cassette storage containing multiple receiving cassettes (each having a BGA product contained therein) and positioned to abut one end of the loading frame, a gripping device arranged at the other end of the loading frame, and a revolving arm assembly arranged among the cutting table, the cleaning station and the loading frame and comprising three revolving arms each having a pivotal end and a distal end respectively extending above the cutting table, the cleaning station and the loading frame with each distal end having a suction device mounted thereon.