Patents Assigned to Unicap Electronics Industrial Corporation
  • Metal core substrate printed wiring board enabling thermally enhanced ball grid array ( BGA) packages and method
    Publication number: 20040163248
    Abstract: A thermally enhanced face-up BGA substrate consists of a metal (copper) core, layers, dielectric layers, conductive through-core and build-up vias. It is a new and simple structure with better thermal performance, resulting in lower cost and better reliability. Moreover, high degree of flexibility in choice of material and layer counts as well as layer thickness allows for a wide range of applications in packaging and high density printed circuit board.
    Type: Application
    Filed: February 24, 2004
    Publication date: August 26, 2004
    Applicant: Unicap Electronics Industrial Corporation
    Inventors: Jane Lu, Paul Wu, Ray Chen, Scott Chen, Jeff Chang
  • Burrless castellation via process and product for plastic chip carrier
    Publication number: 20040141299
    Abstract: This invention incorporates a new process and structure for manufacturing castellation via in plastic chip carrier. It allows the creation of uniform side wall contacts in the shape of half-cylinders, devoid of any burrs and power dust particles, which when present in a plastic chip carrier, would prevent reliable electrical contacts by causing either short or open circuits. Thus the invention enables plastic chip carrier as a practical way of replacing traditional ceramic chip carriers.
    Type: Application
    Filed: January 9, 2004
    Publication date: July 22, 2004
    Applicant: Unicap Electronics Industrial Corporation
    Inventors: Edward Huang, Jonny Ma, Scott Chen, Paul Wu
  • Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages
    Patent number: 6711812
    Abstract: A method of making a thermally enhanced BGA substrate in which a metal (copper) core, has dielectric layers applied to each side thereof and conductive through-core build-up vias are provided. Rigidifying non-conductive dielectric sheets are laminated to the oppositely facing surfaces and then conductive layers are applied to at least one of the rigidifying non-conductive sheets and via connections are made through the dielectric layer(s) to the core conductive layer.
    Type: Grant
    Filed: April 6, 2000
    Date of Patent: March 30, 2004
    Assignee: Unicap Electronics Industrial Corporation
    Inventors: Jane Lu, Paul Wu, Ray Chen, Scott Chen, Jeff Chang
  • Process and structure for manufacturing plastic chip carrier
    Patent number: 6675472
    Abstract: A process for forming a burrless castellation for a plastic chip carrier comprising forming one or more through holes in a substrate, plating the through holes with a metal to a thickness ranging from about 2 microns to about 6 microns, routing slots along the line extending through the through holes to produce half cylinder-shaped side-contact surfaces, and plating the half cylinder-shaped side-contact surfaces to a thickness in the range of 15 to 25 microns.
    Type: Grant
    Filed: April 13, 2000
    Date of Patent: January 13, 2004
    Assignee: Unicap Electronics Industrial Corporation
    Inventors: Edward Huang, Jonny Ma, Scott Chen, Paul Wu