Abstract: A rigid-flex circuit board includes a flexible circuit board, a plurality of patterned photo-imageable substrates and a plurality of patterned circuit layers. The flexible circuit board includes a plurality of exposed regions, a top surface and a bottom surface opposite to the top surface. The exposed regions are respectively located at the top surface and the bottom surface. The patterned photo-imageable substrates are disposed on the top surface and the bottom surface respectively. Each patterned photo-imageable substrate includes an opening exposing the corresponding exposed region. Each patterned photo-imageable substrate includes photo-sensitive material. The patterned circuit layers are disposed on the patterned photo-imageable substrates respectively and expose the exposed regions. A manufacturing method of the rigid-flex circuit board is also provided.
Type:
Application
Filed:
October 3, 2016
Publication date:
June 1, 2017
Applicant:
UNIFLEX Technology Inc.
Inventors:
Yi-Chun Liu, Chiu-Pei Huang, Pei-Hao Hung, Yuan-Chih Lee