Patents Assigned to UNIFLEX Technology Inc.
  • Publication number: 20170156205
    Abstract: A rigid-flex circuit board includes a flexible circuit board, a plurality of patterned photo-imageable substrates and a plurality of patterned circuit layers. The flexible circuit board includes a plurality of exposed regions, a top surface and a bottom surface opposite to the top surface. The exposed regions are respectively located at the top surface and the bottom surface. The patterned photo-imageable substrates are disposed on the top surface and the bottom surface respectively. Each patterned photo-imageable substrate includes an opening exposing the corresponding exposed region. Each patterned photo-imageable substrate includes photo-sensitive material. The patterned circuit layers are disposed on the patterned photo-imageable substrates respectively and expose the exposed regions. A manufacturing method of the rigid-flex circuit board is also provided.
    Type: Application
    Filed: October 3, 2016
    Publication date: June 1, 2017
    Applicant: UNIFLEX Technology Inc.
    Inventors: Yi-Chun Liu, Chiu-Pei Huang, Pei-Hao Hung, Yuan-Chih Lee