Patents Assigned to Unimicron Technology Corp., Ltd.
  • Patent number: 6398099
    Abstract: An apparatus for manufacturing a plug and the manufacturing method. The method includes the following steps. A baseplate located in the bottom of a closed printing chamber is provided. A printed circuit board and a stencil are mounted on the baseplate in sequence. The stencil is aligned to the printed circuit board. An amount of preheated paste is placed on the stencil. A pressure of the closed printing chamber is adjusted to a first pressure. A printing step is performed to form plugs in the printed circuit board. The pressure of the closed printing chamber is adjusted to a second pressure to remove voids trapped in the plugs. The pressure of the closed printing chamber is adjusted to a third pressure. A scraping step is performed to remove the redundant paste.
    Type: Grant
    Filed: July 21, 2000
    Date of Patent: June 4, 2002
    Assignee: Unimicron Technology Corp., Ltd.
    Inventor: Been-Yu Liaw