Abstract: Disclosed herein is a stacked package. The stacked package includes two or more of a first BGA package and a second BGA package and a circuit board having a circuit pattern. The first BGA package is mounted on one face of the circuit board, and the second BGA package is mounted on the other face of the circuit board. A signal connection member is provided for transmitting signals of the first BGA package and the second BGA package to each other. The second BGA package is provided with a signal connection pad. One end of the signal connection member is bonded to the signal connection pad and the other end of the signal connection member is bonded to the circuit pattern of the circuit board. A method of fabricating the stacked package is also disclosed.

Abstract: Disclosed are a stack package and a method of manufacturing the same, which has improved electrical properties by virtue of a reduced signal line length, and also allows reduction of production costs of the stack package. The stack package of the present invention includes panels having an area for mounting respective CSP packages and pin-shaped connectors. The panels include circuit patterns for electrical connection to the CSP packages, which are formed at portions of the panels corresponding to the CSP packages to be mounted. Also, the panels have first openings for electrical connection to the circuit patterns, which are formed at both sides of the circuit patterns. The pin-shaped connectors are inserted through the first openings of the panels. The panels are stacked in at least two layers in such a manner that the first openings of one panel correspond to the first openings of the other panels, so that the connectors are electrically connected to the circuit patterns of the stacked panels.