Patents Assigned to Unit Light Technology Inc.
  • Led structure for flip-chip package and method thereof
    Publication number: 20090140282
    Abstract: LED structure can be packaged by using flip-chip package. An LED structure is covered by a conduction enhancing layer. A bumping area definition layer is then formed on the conduction enhancing layer to expose bumping area portions with p-pad and n-pad underneath, and a bumping pad is then formed over the bumping area portions. The bumping area definition layer and then exposed conduction enhancing layer is removed subsequently.
    Type: Application
    Filed: November 25, 2008
    Publication date: June 4, 2009
    Applicant: Unit Light Technology Inc.
    Inventors: Bor-Jen Wu, Mei-Hui Wu, Chien-An Chen, Yuan-Hsiao Chang
  • LED structure for flip-chip package and method thereof
    Publication number: 20060284321
    Abstract: LED structure can be packaged by using flip-chip package. An LED structure is covered by a conduction enhancing layer. A bumping area definition layer is then formed on the conduction enhancing layer to expose bumping area portions with p-pad and n-pad underneath, and a bumping pad is then formed over the bumping area portions. The bumping area definition layer and then exposed conduction enhancing layer is removed subsequently.
    Type: Application
    Filed: June 21, 2006
    Publication date: December 21, 2006
    Applicant: Unit Light Technology Inc.
    Inventors: Bor-Jen Wu, Mei-Hui Wu, Chien-An Chen, Yuan-Hsiao Chang
  • Method for fabricating LED
    Publication number: 20060286694
    Abstract: A high etching selective layer and a light emitting structure are formed subsequently on a semiconductor substrate. Then, a p-type Ohmic contact layer and a metal substrate are formed subsequently on the light emitting structure. The semiconductor substrate and the high etching selective layer are removed. Next, an n-type electrode and a transparent conductive layer are formed adjacent to surface of the light emitting structure opposite to the metal layer.
    Type: Application
    Filed: June 20, 2006
    Publication date: December 21, 2006
    Applicant: Unit Light Technology Inc.
    Inventors: Bor-Jen Wu, Mei-Hui Wu, Ken Kai-fu Chang, Chien-An Chen, Yuan-Hsiao Chang, Li-Shei Yeh