Abstract: A method of manufacturing a printed circuit board with embedded electronic components fixed by a solder paste includes: providing a carrier board with a copper foil layer on the carrier board, an insulating layer on the copper foil layer, and an opening on the insulating layer by laser; putting a solder paste into the opening to form a solder paste layer; performing a high-temperature reflow process of the electronic components on the solder paste layer until the solder paste layer is molten; curing the solder paste layer after cooling to fix the components to the center position of the opening; placing the copper foil layer below the electronic components and removing the solder paste layer; and performing copper plating and electroplating processes in an electroplating space to form a plating copper. The cohesion of the molten solder paste pulls the electronic components towards the center to eliminate position offset produced when the electronic components are installed.

Abstract: A method for directly attaching dielectric to a circuit board with embedded electronic devices is provided. That is, a plurality of through holes are produced before embedding an electronic device, wherein plural through holes are corresponding to a plurality of electrodes of the electronic device. So that the plural electrodes of the electronic device is accurately positioned with the through holes if the electronic device is being embedded. On the other hand, since the first dielectric layer is adhesive, the electronic device is directly stuck on the first dielectric layer in order to save cost of adhesive material or metal conductive paste in prior arts.

Abstract: In a manufacturing method of a printed circuit board, a rigid substrate having a rigid-board metal layer is provided, an open slot is formed on the rigid substrate, and a flexible substrate is installed in the open slot, and the flexible substrate and the rigid substrate are securely bonded, and an increased-layer circuit layer is formed after electric circuits are manufactured on the rigid-board and flexible-board metal layers, and stacked on the rigid substrate and on an adjacent block where the flexible substrate is coupled to the rigid substrate, and an electric circuit is manufactured, and the increased-layer circuit layer is provided for electrically connecting and conducting the rigid and flexible substrates to overcome the issue of alignment errors.

Abstract: A method of manufacturing a multilayer printed circuit board of a built-in electronic device provides a substrate having a copper clad laminate and a first dielectric layer. The first dielectric layer is laminated onto the copper clad laminate and has a cavity for accommodating the electronic device. A second dielectric layer is laminated onto the substrate and electronic device to produce a base circuit board with an embedded electronic device. A build-up circuit layer is formed on the base circuit board. The first and second dielectric layers are made of a plastic material.

Abstract: The present invention relates to a flash memory card that is a structure using a rigid flexible board (RFB) to connect a flash memory card unit and a universal serial bus (USB) unit. A communication interface in compliance with the specification of the flash memory card is disposed at one end of the flash memory card, and a USB communication interface is disposed at another end, and a rigid flexible board is provided for connecting the electric signals between the two communication interfaces and the bending characteristic is used to maintain the height difference between the planes of the two communication interface, so that the flash memory card can concurrently have the USB communication interface and enhance the applicability of the flash memory card.

Abstract: In a method of partially attaching an additional attaching material for various types of printed circuit boards, the method attaches an additional attaching material partially onto circuit blocks after circuits of the circuit blocks are made on a flexible, rigid or mixed printed circuit board or an insulating layer is coated. The method sets an attaching material on a shaping material that covers the circuit blocks, uses a depth control tool to cut away areas not corresponding to those requiring to be attached onto the necessary circuit blocks, aligns the corresponding positions of the circuit blocks to perform pseudo attachment and pressing, and tears away the shaping material from the attaching material, so as to attach additional attaching materials properly onto the predetermined positions of the circuit blocks without requiring to attach the circuit blocks one by one, and achieve the effect of saving manufacturing time and avoiding misalignment.

Abstract: A method for processing waste copper liquid produces high copper content sludge, mainly by recycling a low copper content waste liquid from production of PCB in order to discharge a comparatively higher copper content sludge. First, the waste liquid is classified into an acidic low concentration copper waste liquid, an acidic high concentration copper waste liquid, and an oxidized acidic high concentration copper waste liquid. Then mix with a strong alkali to react and form a cupric oxide sludge that then undergoes dehydration and baking by applicable equipment to remove water and get a higher copper content sludge. It is therefore unnecessary to add other conversion agents to convert copper hydroxide into cupric oxide, thereby turning the valueless low copper content sludge from a waste liquid into a valuable recyclable high copper content sludge.

Abstract: A precision printed circuit board testing tool includes a testing tube, having a hollow chamber for installing a second resilient element, and the testing tube being electrically connected to a second testing line; a second testing element, installed in the hollow chamber, and having a second chamber and an opening, and the second testing element being pressed against by the second resilient element; a first testing element, having an internal bushing, a first resilient element and a probe, and including a first chamber for installing the first resilient element, and the probe being installed in the first chamber and pressed against by the first resilient element, and the first testing element being electrically connected to a first testing line. The testing tool is used for testing a PCB circuit with micro resistance to prevent defectives and damages of electronic components.

Abstract: A precision printed circuit board testing tool includes a testing tube, having a hollow chamber for installing a second resilient element, and the testing tube being electrically connected to a second testing line; a second testing element, installed in the hollow chamber, and having a second chamber and an opening, and the second testing element being pressed against by the second resilient element; a first testing element, having an internal bushing, a first resilient element and a probe, and including a first chamber for installing the first resilient element, and the probe being installed in the first chamber and pressed against by the first resilient element, and the first testing element being electrically connected to a first testing line. The testing tool is used for testing a PCB circuit with micro resistance to prevent defectives and damages of electronic components.

Abstract: In a method of partially attaching an additional attaching material for various types of printed circuit boards, the method attaches an additional attaching material partially onto circuit blocks after circuits of the circuit blocks are made on a flexible, rigid or mixed printed circuit board or an insulating layer is coated. The method sets an attaching material on a shaping material that covers the circuit blocks, uses a depth control tool to cut away areas not corresponding to those requiring to be attached onto the necessary circuit blocks, aligns the corresponding positions of the circuit blocks to perform pseudo attachment and pressing, and tears away the shaping material from the attaching material, so as to attach additional attaching materials properly onto the predetermined positions of the circuit blocks without requiring to attach the circuit blocks one by one, and achieve the effect of saving manufacturing time and avoiding misalignment.

Abstract: The present invention discloses a universal grid composite circuit board testing tool having a probe station, a clamp base and a conducting wire base. The probe station and clamp base separately have a plurality of conducting probes and long needles. Both ends of the long needle are electrically contacted with the testing point and conducting probe of the testing printed circuit board. The conducting wire base includes a conducting wire contact point electrically connected to a plurality of conducting probes in the probe station at the same time, such that when a testing printed circuit board is tested, it is not necessary to prepare a new probe station and a new conducting wire base. The test simply requires users to change the installation positions of the long needles and run a comparison program according to the positions of the testing points of the testing printed circuit board.

Abstract: The present invention discloses a method for processing waste copper solution/liquid to produce high copper content sludge, mainly by recycling a low copper content waste solution from production of PCB in order to discharge a comparatively higher copper content sludge; first classify the waste solution into an acidic low concentration copper waste solution, an acidic high concentration copper waste solution, and an oxidized acidic high concentration copper waste liquid, and then mix with a strong alkali to react and form a cupric oxide sludge, then undergo dehydration/baking by an applicable equipment to remove water and get a comparatively higher copper content sludge; therefore, it is unnecessary to add other conversion agents to convert copper hydroxide into cupric oxide, thereby turning the valueless low copper content sludge from a waste water (or liquid) into a valuable recyclable high copper content sludge.

Abstract: The present invention discloses a universal grid composite circuit board testing tool having a probe station, a clamp base and a conducting wire base. The probe station and clamp base separately have a plurality of conducting probes and long needles. Both ends of the long needle are electrically contacted with the testing point and conducting probe of the testing printed circuit board. The conducting wire base includes a conducting wire contact point electrically connected to a plurality of conducting probes in the probe station at the same time, such that when a testing printed circuit board is tested, it is not necessary to prepare a new probe station and a new conducting wire base. The test simply requires users to change the installation positions of the long needles and run a comparison program according to the positions of the testing points of the testing printed circuit board.

Abstract: The present invention relates to a flash memory card that is a structure using a rigid flexible board (RFB) to connect a flash memory card unit and a universal serial bus (USB) unit. A communication interface in compliance with the specification of the flash memory card is disposed at one end of the flash memory card, and a USB communication interface is disposed at another end, and a rigid flexible board is provided for connecting the electric signals between the two communication interfaces and the bending characteristic is used to maintain the height difference between the planes of the two communication interface, so that the flash memory card can concurrently have the USB communication interface and enhance the applicability of the flash memory card.

Abstract: The invention relates to a complex printed circuit board testing tool having a testing platform, a base disposed on the testing platform, a probe coupled to the testing platform and disposed on the base, and a conversion board disposed between the bases. The conversion board has a testing protrusion corresponding to the testing printed circuit board and a probe testing point corresponding to the probe. A pressure contact rubber covers the surface of the conversion board, so that the probe testing points on the printed circuit board contact with the protrusions on the conversion board through the pressure contact rubber, and the testing can be performed when the conversion board is in contact with the probe on the base, without using a probe of a special specification, and breaking through the limitation of testing areas and testing points. The invention saves costs and leaves no needle marks after the testing.

Abstract: A method for applying the solder mask onto solder pad spacings of a printed circuit board, mainly referring to the use of an ink-jet printer for printing the solder mask at the dense solder pad area on a printed circuit board, so as to prevent the solder mask from being coated onto solder pads in the dense solder pad area, thus improving the reliability of assembling processes for electronic products, and further providing merits of minimizing clearances between the solder mask and solder pads and increasing the adhesion of the solder mask.

Abstract: The present invention relates to a manufacturing method of rigid flexible printed circuit board. Inner layer circuit are etched on two side of a flexible basefilm and a flat cable for connecting the inner layer circuit on lateral sides is disposed on the middle part thereof. Then layer of outer copper foil without bondfilm made of reinforced fiber on the bottom side thereof is laminated on both sides of the flexible basefilm respectively and drilled a number of through holes on connecting points of preset circuitry thereof. Subsequently, each through hole is metalized and plated for electrically connecting outer copper foil and inner layer circuit on flexible basefilm by means of such plated layer. The copper foil on the top of the flat cable that is on the middle of the flexible basefilm is removed and out layer circuit is made on outer copper foil. At last, the outer layer circuit is covered by solder resist mask.

Abstract: A method of manufacturing a printed circuit board (PCB) having wiring layers electrically connected via solid cylindrical copper interconnecting bodies includes the following steps: locally providing on a base or an insulated layer with a first copper foil wiring layer; fully coating the first wiring layer with a conductive layer; coating areas on the first wiring layer that are not used for interconnection purpose with a layer of dry-film resist to expose other areas on the first wiring layer to be used for interconnection purpose; removing the conductive layer by micro etching; forming solid cylindrical copper interconnecting bodies of a desired height on the interconnecting areas through electric plating; removing the dry-film resist, so that the solid cylindrical copper interconnecting bodies consisting of pure copper project from the interconnecting areas; and providing a second wiring layer over the first wiring layer.

Abstract: A method of removing and replacing a defective piece of printed circuit board formed on a panel, including the steps of using a router to form a breaking aperture at each connecting joint around a good piece on an unqualified panel, so that a connecting edge about 50 &mgr;m long is left at each end of the breaking aperture, and breaking the connecting edges through one punch to remove the good piece from the panel; using the same way to remove a bad piece from a qualified panel to produce a void having size and shape identical to those of the removed good piece; positioning the removed good piece into the void; and filling the reconnected breaking aperture with bonding agent to securely connect the substitute good piece to the panel, allowing subsequent printing of solder layer and insertion of surface mounting devices to be smoothly completed on the panel.