Abstract: Provided is an inspection socket capable of elastically contacting the conductor with the electrode of the object to be tested and the electrode for inspection by pushing the object to be inspected toward the inspection substrate side, without adhering foreign matters or contact marks to the object to be inspected. The inspection socket is so configured that the object to be inspected (100) is pushed toward the inspection substrate (10) without touching the object to be inspected (100), by integrally holding the object to be inspected (100) and the positioning table (20) using air pressure (negative pressure or positive pressure) and pushing the positioning table (20) by the pushing unit (50), so that the object to be inspected comes into contact with the land (11) of the inspection substrate (10) through the contact probe (30).

Abstract: A contact probe can be easily mass-produced, reduce manufacturing cost, and obtain a stable contact state with an electrode such as a land of an inspection substrate. An inspection socket can be provided with the contact probe. The contact probe has a first contact terminal that contacts a solder ball of a device under test and a second contact terminal that contacts a land of a printed substrate, and a coil spring for urging contact terminals so as to separate the first and the second terminals. The first contact terminal is constituted by a first contact element formed by a rod-shaped metal member, and the second contact terminal is constituted by two second contact elements formed by a plate-shaped metal member and which clamp the first contact element in frictional contact with a part of the first contact element.

Abstract: A semiconductor test apparatus capable of securely having the contact pin and the external contact terminal held in contact with each other even in case where the vertical type handler is used. The semiconductor test apparatus comprises: a test socket having a socket surface formed thereon, the socket surface having a contact pin towering therefrom; and a semiconductor transport fixture having a concave portion formed thereon, the concave portion adapted to receive therein an IC under test, wherein the test socket has a position adjustment guide provided thereon, the semiconductor transport fixture has a guide through bore formed therein, the guide through bore adapted to receive the position adjustment guide therethrough when the IC under test comes under test, and either one of the position adjustment guide or the guide through bore is formed in a tapered shape.

Abstract: A semiconductor test apparatus capable of securely having the contact pin and the external contact terminal held in contact with each other even in case where the vertical type handler is used. The semiconductor test apparatus comprises: a test socket having a socket surface formed thereon, the socket surface having a contact pin towering therefrom; and a semiconductor transport fixture having a concave portion formed thereon, the concave portion adapted to receive therein an IC under test, wherein the test socket has a position adjustment guide provided thereon, the semiconductor transport fixture has a guide through bore formed therein, the guide through bore adapted to receive the position adjustment guide therethrough when the IC under test comes under test, and either one of the position adjustment guide or the guide through bore is formed in a tapered shape.

Abstract: The semiconductor transporting and testing fixture according to the present invention comprises: a frame portion (21) adapted to receive therein an IC (5) having an external connection terminal, the frame portion having an inner peripheral wall; a bottom surface sheet (25) pasted on a bottom surface of the frame portion, the bottom surface sheet having an IC side pad (26) formed on a front surface thereof and a socket side pad (27) formed on a rear surface thereof, the IC side pad being adapted to contact the external connection terminal, the socket side pad electrically connected with the corresponding IC side pad and being adapted to contact a testing socket, wherein the frame portion (21) is provided with a retaining latch (23) protruding therefrom toward above the IC (5) when the IC (5) is received in the inner peripheral wall (22) of the frame portion (21).

Abstract: A Kelvin inspection fixture is provided with contact probes, wherein the contact probe comprises an electrode side contact terminal in contact with a solder ball, and a land side contact terminal in contact with a land, and the contact probe comprises an electrode side contact terminal in contact with the solder ball, and a land side contact terminal in contact with a land. The contact probes are disposed so that an electrode side inclined face and an electrode side inclined face are held in an opposite relationship with respect to each other and so that a land side inclined face and a land side inclined face are held in a face to face relationship with respect to each other.

Abstract: It is an object of the present invention to provide a double-ended contact probe that can be improved in productivity to ensure that the contact members are stably movable with respect to each other, and electrically connected to each other.

Abstract: It is an object of the present invention to provide a double-ended contact probe that can be improved in productivity to ensure that the contact members are stably movable with respect to each other, and electrically connected to each other.

Abstract: An anisotropic conductivity sheet (10) comprising an insulating sheet (11) having a number of through-holes (12) and a number of conductive bodies is provided. The insulating sheet (11) has an inner layer (11A) of a heat resistant fuloro-elastomer and surface thin layers (11B, 11C) of heat-resistant engineering plastics. Each of the conductive bodies is a wire loop (13) formed to generally elliptic shape. They are arranged within each of the through-holes (12) so that long axis of each wire loop (13) extends in the thickness direction of the insulating sheet (11). The anisotropic conductivity sheet (10) is suitable to use for electrical test of a semiconductor devise (16), such as IC. A signal waveform-rectifying sheet (20) is preferably arranged on the anisotropic conductivity sheet (10). The signal waveform-rectifying sheet (20) has though-holes (22) in which electrical components for rectifying signals and currents, such as resistors (23A), LEDs (23B), LR circuits (23C) and capacitors (23D), are filled up.

Abstract: A novel jig device useful for transporting and testing an IC chip is disclosed. The jig device comprises a main jig body, having a holding part onto which the IC chip to be tested is attracted and held and at least one suction path is formed, and at least one contact probe arranged in the suction path of the main jig body. The main jig body comprises preferably a base part and front head part. The contact probe connects electronically between a terminal of the IC chip held at the holding part and an electrode of circuit board of tester.

Abstract: A connector structure comprising a first connecting layer and a second connecting layer. The first connecting layer consists of an electrically insulated portion and a plurality of electrical conductive portions each having first and second surfaces opposing to each other. The first surfaces of the electrically conductive portions are to respectively receive and be held in electrical contact with the terminals of the first electric part. The second connecting layer consists of an electrically insulated sheet and a plurality of electrically conductive paths respectively passing through the electrically insulated sheet obliquely. Each of the electrically conductive paths has first and second ends opposing each other. The second ends of the electrically conductive paths are to respectively receive and be held in electrical contact with the terminals of the second electronic part.

Abstract: An electrical connector for interconnecting a first circuit such as an integrated circuit having a plurality of IC terminals with a second circuit having a plurality of contact pads when the terminals and pads are positioned opposite each other. The connector includes an electrically insulating sheet made of a first elastic material formed with a plurality of bores extending therethrough in a direction mutually perpendicular to the first and second circuits, and a plurality of electrical conductors, each made of a second, electrically conductive elastic material and shaped so as to contact the first circuit terminals. The elastic material electrical conductors are each positioned relative to the electrically insulating sheet so as to cover each of the bores and extend into the bore co-axially therewith.

Abstract: Herein disclosed a connector for electrically connecting an integrated circuit having a plurality of IC terminals with an electronic circuit having a plurality of electronic pads each corresponding to each of the IC terminals of the integrated circuit.The connector comprises an insulating elastic sheet having first and second surfaces and formed with a plurality of through bores at the positions corresponding to the IC terminals of the integrated circuit and a plurality of conductive portions to be respectively received in the through bores of the insulating elastic sheet.

Abstract: Herein disclosed is a test device for testing an integrated circuit (IC) chip having side edge portions each provided with a set of lead pins. The test device comprises a socket base, contact units each including a contact support member and socket contact members, and anisotropic conductive sheet assemblies each including an elastic insulation sheet and conductive members. The anisotropic conductive sheet assemblies are arranged to hold each conductive member in contact with one of the socket contact members of the contact units. The test device further comprises a contact retainer detachably mounted on the socket base to bring the socket contact members into contact with the anisotropic conductive sheet assemblies to establish electrical communication between the socket contact members and the conductive members of the anisotropic conductive sheet assemblies.

Abstract: Herein disclosed is a test device for testing an integrated circuit (IC) chip having a plurality of side edge portions each provided with a set of contact members. The test device comprises a socket base on which the IC chip is to be set, a plurality of contact units each including a contact support member and a set of socket contact members supported by the contact support member, and a contact retainer detachably mounted on the socket base to have the contact units retained with the socket contact members being held in contact with the contact members of the IC chip while the IC chip is set on the socket base. Each of the contact units can be removed from the socket base and replaced by a new contact unit if the socket contact members partly become fatigued and damaged, thereby making it possible to facilitate the maintenance of the test device.