Patents Assigned to United Microelectronice Corp.
  • POST METAL ETCH CLEANING METHOD
    Publication number: 20020111033
    Abstract: A post metal etch cleaning method which begins by providing a wafer with an etched metal layer formed thereon, wherein the etched metal layer is covered with a polymer residue. A fluorine based organic acid solvent is used to clean the metal layer, followed by removing the solvent by a physical method. Next, a de-ionized water is applied to flush the metal layer before performing a drying step on the wafer to dry the metal layer.
    Type: Application
    Filed: February 26, 2001
    Publication date: August 15, 2002
    Applicant: United Microelectronice Corp.
    Inventors: Chih-Ning Wu, Chan-Lon Yang