Patents Assigned to United Microelectronics Corp.
  • Publication number: 20220246839
    Abstract: An MRAM structure includes a dielectric layer. A first MRAM, a second MRAM and a third MRAM are disposed on the dielectric layer, wherein the second MRAM is disposed between the first MRAM and the third MRAM, and the second MRAM includes an MTJ. Two gaps are respectively disposed between the first MRAM and the second MRAM and between the second MRAM and the third MRAM. Two tensile stress pieces are respectively disposed in each of the two gaps. A first compressive stress layer surrounds and contacts the sidewall of the MTJ entirely. A second compressive stress layer covers the openings of each of the gaps and contacts the two tensile material pieces.
    Type: Application
    Filed: April 20, 2022
    Publication date: August 4, 2022
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Da-Jun Lin, Min-Hua Tsai, Tai-Cheng Hou, Fu-Yu Tsai, Bin-Siang Tsai
  • Publication number: 20220246226
    Abstract: A power circuit is adapted for providing a programming voltage to an electronic fuse circuit, and includes a pass transistor of a P-type metal-oxide-semiconductor transistor, a buffer circuit, and a bulk voltage control circuit. The pass transistor includes a bulk electrode, a gate electrode, a first source/drain electrode receiving a system high voltage, and a second source/drain electrode connected to a bit line. The buffer circuit provides a control voltage to the gate electrode of the pass transistor. The pass transistor is turned on during a programming operation and turned off during a reading operation. The bulk voltage control circuit independently provides a bulk voltage to the bulk electrode. A last-stage buffer of the buffer circuit is also activated by the bulk voltage to control the pass transistor during the reading operation of the electronic fuse circuit. A method for providing power to an electronic fuse circuit is also provided.
    Type: Application
    Filed: April 7, 2021
    Publication date: August 4, 2022
    Applicant: United Microelectronics Corp.
    Inventors: Chia Wei Ho, Min Chia Wang, Chung Ming Lin, Jin Pang Chi
  • Patent number: 11404631
    Abstract: A magnetoresistive random access memory (MRAM) structure includes a magnetic tunnel junction (MTJ), and a top electrode which contacts an end of the MTJ. The top electrode includes a top electrode upper portion and a top electrode lower portion. The width of the top electrode upper portion is larger than the width of the top electrode lower portion. A bottom electrode contacts another end of the MTJ. The top electrode, the MTJ and the bottom electrode form an MRAM.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: August 2, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Kuo-Chih Lai, Yi-Syun Chou, Ko-Wei Lin, Pei-Hsun Kao, Wei Chen, Chia-Fu Cheng, Chun-Yao Yang, Chia-Chang Hsu
  • Patent number: 11404305
    Abstract: A manufacturing method a semiconductor device includes the following steps. A first mask pattern and a second mask pattern are formed on a first region and a second region of a substrate respectively. The second region is located adjacent to the first region. A top surface of the first mask pattern is lower than a top surface of the second mask pattern in a thickness direction of the substrate. A trench is formed in the substrate. The trench is partly located in the first region and partly located in the second region. A first etching process is performed for reducing a thickness of the second mask pattern and reducing a height difference between the top surface of the first mask pattern and the top surface of the second mask pattern in the thickness direction of the substrate. An isolation structure is formed in the trench after the first etching process.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: August 2, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ta-Wei Chiu, Shin-Hung Li, Tsung-Yu Yang, Ruei-Jhe Tsao
  • Patent number: 11404425
    Abstract: The present invention provides a test key structure, the test key structure a substrate, a plurality of test key cells disposed on the substrate, wherein each test key cell includes a first gate structure arranged along a first direction (X-axis), a first diffusion region, a second diffusion region, a connection diffusion region and a share contact arranged along a second direction (Y-axis), wherein the first gate structure crosses over the first diffusion region to form a pull-up transistor (PU), the second gate structure crosses over the second diffusion region to form a pull-down transistor (PD), and wherein the plurality of share contacts and the plurality of connection diffusion regions of the plurality of test key cells are electrically connected to each other.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: August 2, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Fang-Sheng Chou, Ching Chang
  • Patent number: 11403728
    Abstract: An automatic adjusting method for equipment and a smart adjusting device using the same are provided. The automatic adjusting method of the equipment includes the following steps. A template frame from the equipment is obtained in an initial period. Several clear frames are obtained in one window period. Each of the template frame and the clear frame has a pixel variation. The pixel variation of the template frame is the largest in the initial period. The pixel variation of each of the clear frame is greater than a threshold. Each of the clear frame is compared with the template frame to obtain an offset. A statistical value of the offsets is calculated. A parameter of the equipment is adjusted to reduce the statistical value.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: August 2, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yu-Chi Lin, Li-Hsin Yang, Ching-Pei Lin, Ming-Wei Chen, Wei-Hong Zhu
  • Publication number: 20220238600
    Abstract: An MRAM structure includes a dielectric layer. A contact hole is disposed in the dielectric layer. A contact plug fills in the contact hole and protrudes out of the dielectric layer. The contact plug includes a lower portion and an upper portion. The lower portion fills in the contact hole. The upper portion is outside of the contact hole. The upper portion has a top side and a bottom side greater than the top side. The top side and the bottom side are parallel. The bottom side is closer to the contact hole than the top side. An MRAM is disposed on the contact hole and contacts the contact plug.
    Type: Application
    Filed: April 11, 2022
    Publication date: July 28, 2022
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Yi-Hui Lee, I-Ming Tseng, Ying-Cheng Liu, Yi-An Shih, Yu-Ping Wang
  • Patent number: 11398548
    Abstract: A semiconductor device and a method for manufacturing the semiconductor device are provided. The semiconductor device includes an insulating layer, a semiconductor layer, a plurality of isolation structures, a transistor, a first contact, a plurality of silicide layers, and a protective layer. The semiconductor layer is disposed on a front side of the insulating layer. The plurality of isolation structures are disposed in the semiconductor layer. The transistor is disposed on the semiconductor layer. The first contact is disposed beside the transistor and passes through one of the plurality of isolation structures and the insulating layer therebelow. The plurality of silicide layers are respectively disposed on a bottom surface of the first contact and disposed on a source, a drain, and a gate of the transistor. The protective layer is disposed between the first contact and the insulating layer.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: July 26, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Wen-Shen Li, Ching-Yang Wen, Purakh Raj Verma, Xingxing Chen, Chee-Hau Ng
  • Publication number: 20220230975
    Abstract: A radiofrequency device includes a buried insulation layer, a transistor, a contact structure, a connection bump, an interlayer dielectric layer, and a mold compound layer. The buried insulation layer has a first side and a second side opposite to the first side in a thickness direction of the buried insulation layer. The transistor is disposed on the first side of the buried insulation layer. The contact structure penetrates the buried insulation layer and is electrically connected with the transistor. The connection bump is disposed on the second side of the buried insulation layer and electrically connected with the contact structure. The interlayer dielectric layer is disposed on the first side of the buried insulation layer and covers the transistor. The mold compound layer is disposed on the interlayer dielectric layer. The mold compound layer may be used to improve operation performance and reduce manufacturing cost of the radiofrequency device.
    Type: Application
    Filed: April 7, 2022
    Publication date: July 21, 2022
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Purakh Raj Verma, Wen-Shen Li, Ching-Yang Wen
  • Patent number: 11393826
    Abstract: A method of forming a semiconductor device includes the following steps. First of all, a substrate is provided, and a dielectric layer is formed on the substrate. Then, at least one trench is formed in the dielectric layer, to partially expose a top surface of the substrate. The trench includes a discontinuous sidewall having a turning portion. Next, a first deposition process is performed, to deposit a first semiconductor layer to fill up the trench and to further cover on the top surface of the dielectric layer. Following these, the first semiconductor layer is laterally etched, to partially remove the first semiconductor layer till exposing the turning portion of the trench. Finally, a second deposition is performed, to deposit a second semiconductor layer to fill up the trench.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: July 19, 2022
    Assignees: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Luo-Hsin Lee, Ting-Pang Chung, Shih-Han Hung, Po-Han Wu, Shu-Yen Chan, Shih-Fang Tzou
  • Publication number: 20220223716
    Abstract: A high electron mobility transistor (HEMT) includes a buffer layer on a substrate, a barrier layer on the buffer layer, a gate electrode on the barrier layer, a field plate adjacent to two sides of the gate electrode, and a first passivation layer adjacent to two sides of the gate electrode. Preferably, a sidewall of the field plate includes a first curve.
    Type: Application
    Filed: March 28, 2022
    Publication date: July 14, 2022
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: An-Chi Liu, Chun-Hsien Lin
  • Publication number: 20220223728
    Abstract: A semiconductor device includes a substrate having a first region and a second region, a first fin-shaped structure extending along a first direction on the first region, a double diffusion break (DDB) structure extending along a second direction to divide the first fin-shaped structure into a first portion and a second portion, and a first gate structure and a second gate structure extending along the second direction on the DDB structure.
    Type: Application
    Filed: March 28, 2022
    Publication date: July 14, 2022
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Shou-Wan Huang, Chun-Hsien Lin
  • Publication number: 20220223710
    Abstract: A method for fabricating semiconductor device includes the steps of first providing a substrate having a first region and a second region, forming a first bottom barrier metal (BBM) layer on the first region and the second region, forming a first work function metal (WFM) layer on the first BBM layer on the first region and the second region, and then forming a diffusion barrier layer on the first WFM layer.
    Type: Application
    Filed: March 30, 2022
    Publication date: July 14, 2022
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Yi-Fan Li, Wen-Yen Huang, Shih-Min Chou, Zhen Wu, Nien-Ting Ho, Chih-Chiang Wu, Ti-Bin Chen
  • Publication number: 20220223515
    Abstract: An interconnect structure is formed in a semiconductor device. The interconnect structure includes a dielectric layer disposed over a substrate. The dielectric layer includes a region and a plurality of protrusions. The protrusions are distributed in the region. A metal layer is disposed on the dielectric layer. Tops of the protrusions are exposed with respect to the metal layer. Any straight path crossing through a central region of the region is always intersected with a portion of the protrusions.
    Type: Application
    Filed: February 3, 2021
    Publication date: July 14, 2022
    Applicant: United Microelectronics Corp.
    Inventors: To-Wen Tsao, Ching-Chang Hsu
  • Publication number: 20220223612
    Abstract: A memory structure including a substrate, a first dielectric layer, a second dielectric layer, a charge storage layer, an oxide layer, and a conductive layer is provided. The first dielectric layer is disposed on the substrate. The second dielectric layer is disposed on the first dielectric layer. The charge storage layer is disposed between the first dielectric layer and the second dielectric layer. The oxide layer is located at two ends of the charge storage layer and is disposed between the first dielectric layer and the second dielectric layer. The conductive layer is disposed on the second dielectric layer.
    Type: Application
    Filed: March 15, 2021
    Publication date: July 14, 2022
    Applicant: United Microelectronics Corp.
    Inventors: Chia-Hung Chen, Yu-Huang Yeh, Chuan-Fu Wang
  • Patent number: 11387148
    Abstract: A semiconductor device includes: a substrate having a first region and a second region; a first fin-shaped structure on the first region and a second fin-shaped structure on the second region, wherein each of the first fin-shaped structure and the second fin-shaped structure comprises a top portion and a bottom portion; a first doped layer around the bottom portion of the first fin-shaped structure; a second doped layer around the bottom portion of the second fin-shaped structure; a first liner on the first doped layer; and a second liner on the second doped layer.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: July 12, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Li-Wei Feng, Shih-Hung Tsai, Chao-Hung Lin, Hon-Huei Liu, Shih-Fang Hong, Jyh-Shyang Jenq
  • Patent number: 11387337
    Abstract: A memory device includes a main cell on a substrate, a first reference cell adjacent to one side of the main cell, and a second reference cell adjacent to another side of the main cell. Preferably, the main cell includes a first gate electrode on the substrate, a second gate electrode on one side of the first gate electrode and covering a top surface of the first gate electrode, a first charge trapping layer between the first gate electrode and the second gate electrode and including a first oxide-nitride-oxide (ONO) layer, a third gate electrode on another side of the first gate electrode and covering the top surface of the first gate electrode, and a second charge trapping layer between the first gate electrode and the third gate electrode and including a second ONO layer.
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: July 12, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Sung Huang, Shen-De Wang, Chia-Ching Hsu, Wang Xiang
  • Patent number: 11387412
    Abstract: A resistive memory device includes a first stacked structure and a second stacked structure. The first stacked structure includes a first bottom electrode, a first top electrode disposed on the first bottom electrode, and a first variable resistance layer disposed between the first bottom electrode and the first top electrode in a vertical direction. The second stacked structure includes a second bottom electrode, a second top electrode disposed on the second bottom electrode, and a second variable resistance layer disposed between the second bottom electrode and the second top electrode in the vertical direction. A thickness of the first variable resistance layer is less than a thickness of the second variable resistance layer for increasing the number of switchable resistance states of the resistive memory device.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: July 12, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventor: Po-Yu Yang
  • Patent number: 11387408
    Abstract: A magnetoresistive random access memory (MRAM), including a bottom electrode layer on a substrate, a magnetic tunnel junction stack on the bottom electrode layer, and a top electrode layer on the magnetic tunnel junction stack, wherein the material of top electrode layer is titanium nitride, and the percentage of nitrogen in the titanium nitride gradually decreases from the top surface of top electrode layer to the bottom surface of top electrode layer.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: July 12, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Chin-Yang Hsieh, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, Jing-Yin Jhang, I-Ming Tseng, Yu-Ping Wang, Chien-Ting Lin, Kun-Chen Ho, Yi-Syun Chou, Chang-Min Li, Yi-Wei Tseng, Yu-Tsung Lai, Jun Xie
  • Publication number: 20220216345
    Abstract: A structure of field-effect transistor includes a silicon layer of a silicon-on-insulator structure. A gate structure layer in a line shape is disposed on the silicon layer, wherein the gate structure layer includes a first region and a second region abutting to the first region. Trench isolation structures in the silicon layer are disposed at two sides of the gate structure layer, corresponding to the second region. The second region of the gate structure layer is disposed on the silicon layer and overlaps with the trench isolation structure. A source region and a drain region are disposed in the silicon layer at the two sides of the gate structure layer, corresponding to the first region. The second region of the gate structure layer includes a conductive-type junction portion.
    Type: Application
    Filed: March 27, 2022
    Publication date: July 7, 2022
    Applicant: United Microelectronics Corp.
    Inventors: Su Xing, Chung Yi Chiu, Hai Biao Yao