Abstract: The invention relates to a miniature microwave component having: a microwave chip (18, 60, 140) encapsulated in an individual package (61) for surface mounting. A metal base (80) mounts the chip in the package via its rear face. The base has an aperture (82). At least two access ports are provided for the communication of electrical signals between the inside and the outside of the package. A contactless microwave access port (62), by electromagnetic coupling at the aperture in the base, ensures transmission of coupling signals at a working frequency F0. A subharmonic access port (110) via a contact, inputs, into the integrated circuit, a subharmonic frequency F0/n of the working frequency F0. The chip includes, among its electrical conductors, a coupling electrical conductor (96) connected to the electronic elements of the chip. The coupling conductor is placed at the contactless microwave access port (62) in order to transmit microwave signals by electromagnetic coupling at the working frequency F0.

Abstract: A miniature component includes an MMIC microwave chip encapsulated in an individual package for surface-mounting capable of operating at a frequency F0 very much higher than 45 GHz; and at least one contactless microwave port, by electromagnetic coupling, ensuring the transmission of coupling signals at a working frequency F0.

Abstract: The invention relates to a miniature microwave component having: a microwave chip (18, 60, 140) encapsulated in an individual package (61) for surface mounting. A metal base (80) mounts the chip in the package via its rear face. The base has an aperture (82). At least two access ports are provided for the communication of electrical signals between the inside and the outside of the package. A contactless microwave access port (62), by electromagnetic coupling at the aperture in the base, ensures transmission of coupling signals at a working frequency F0. A subharmonic access port (110) via a contact, inputs, into the integrated circuit, a subharmonic frequency F0/n of the working frequency F0. The chip includes, among its electrical conductors, a coupling electrical conductor (96) connected to the electronic elements of the chip. The coupling conductor is placed at the contactless microwave access port (62) in order to transmit microwave signals by electromagnetic coupling at the working frequency F0.

Abstract: The invention relates to a miniature microwave package comprising a microwave chip (60) having an active face (62). The chip includes a protective lid (72) fixed to the active face, at least partially covering it, the lid including at least one recess forming, with the active face of the chip, a cavity (94, 96, 98). The invention is used in miniature microwave packages.

Abstract: The invention relates to millimetric packaged electronic components for applications at high frequencies greater than 45 GHz. According to the invention, to facilitate the design of a system including MMIC chips working at these frequencies, it is proposed to use packages containing one or more chips, these packages making it possible to work at these frequencies and including two types of port: a port with transition by contactless electromagnetic coupling providing a connection with an antenna at the high working frequency F via a waveguide; and a port with microstrip or coaxial line type transition enabling a connection at a subharmonic frequency F/N (preferably N=6 or 4 or, if necessary, 3) of the working frequency.