Patents Assigned to United Test & Assembly Center Limited of Singapore
  • Multiple chip semiconductor packages
    Publication number: 20040012079
    Abstract: A semiconductor package, containing two or more IC devices. The IC devices are oriented in the same manner and at least two IC devices are separated by a die paddle that is attached to the active face of one of the IC devices, inward of the electrical contact areas.
    Type: Application
    Filed: January 21, 2003
    Publication date: January 22, 2004
    Applicant: United Test & Assembly Center Limited of Singapore
    Inventor: Wang Chuen Khiang