Abstract: A wire stringing apparatus interconnects terminals of electronic components mounted upon a circuit board. A wire stringing head, which is transported on an x-y mechanism driven by a controller, wraps an insulated wire about terminals and guide pins mounted on the circuit board. The insulated wire is connected throughout the circuitry to form all of the necessary interconnections. After the wire is installed an automatic solder feeding mechanism and a heating element are transported over the circuit board to selectively solder the interconnecting wire to the appropriate component terminals. The heat generated for the soldering procedure additionally removes the insulation from the interconnecting wire at the connection terminal. A cutting tool transported over the circuit board severs the interconnecting wire at selected points to form individual conduction paths between circuit terminals.

Abstract: Wire routing guides are used on circuit boards employing solder pads plated onto the reverse side of an insulative board in an orthogonal array and connected to aligned conductive areas on the obverse side by plated-through holes. The wire routing guides, having upstanding fingers, are mounted on the reverse side of the board with conductive pins from electrical components extending through the holes in the board from the obverse side to the reverse side. Insulated wire is threaded around the wire routing guides and pins of the electrical components and guided in accordance with a predetermined pattern of component interconnections. For interconnections between points on the board, wire is threaded substantially orthogonally.