Abstract: Methods for electroplating metal can include passing an electrical current through a conductive surface and an electroplating solution adjacent the conductive surface. An electroplating voltage for the conductive surface and the electroplating solution can be determined based on the electrical current through the conductive surface and the electroplating solution adjacent the conductive surface. The determined electroplating voltage can then be maintained while electroplating the metal from the electroplating solution on the conductive surface. Related systems are also discussed.
Type:
Grant
Filed:
January 11, 2002
Date of Patent:
September 21, 2004
Assignee:
Unitive International Limited Curaco
Inventors:
Curtis Grant Jones, William Boyd Rogers, Glenn A. Rinne