Abstract: The present invention discloses a uniform light emitting lamp structure including a lamp holder, an electric connection portion and a planar portion disposed on both end surfaces of the lamp holder respectively, and the planar portion includes a circuit board electrically coupled to the electric connection portion. The lamp structure further includes an LED light source, a lamp cover and a light guide column with a refractive index n1. After the light of the LED light source is projected from an environmental medium with a refractive index n2 to the light guide column, a portion of the light is reflected from the critical plane in a direction corresponding to the lamp holder through reflections and refractions, such that the light of the LED light source is projected in the environmental medium to achieve the uniform light emitting effect.

Abstract: A structure of lighting device includes a hood, a heat dissipater, at least one substrate board, and a fastener. The hood forms a receiving space, at least one fitting slot, and at least one heat dissipation opening. The fitting slot is located inside the receiving space. The heat dissipation opening is defined in a circumferential surface of the hood. The heat dissipater is received in the receiving space. The heat dissipater forms at least one guide section. The guide section opposes the fitting slot and is received in the fitting slot. The substrate board is electrically connected to at least one light-emitting diode. The substrate board is coupled to the heat dissipater. The heat dissipation opening allows for air circulation for removing heat generated by light-emitting diodes. Further, the heat dissipation opening is formed to have a width W less than 3 mm, and the heat dissipater is arranged to be spaced from a circumferential surface of the hood by a distance greater than 6 mm.

Abstract: A lighting device includes a base, an optic lens assembly, and a light emission module. The base has an end forming an opening. The optic lens assembly is received in the opening and has a central portion forming a first light projection section and a circumferential portion that forms a second light projection section surrounding the first light projection section. The light emission module is received in the base and includes at least one first light emission element corresponding to the first light projection section and a plurality of second light emission elements which is arranged around the first light emission element and corresponds to the second light projection section.

Abstract: A lighting device includes a base, a hollow body, a substrate board, and a cover. The base includes a control unit mounted thereto. The hollow body includes an inside wall and has an end coupled to the base. The substrate board has a surface to which at least one light emission element is mounted and has a circumference engaging and supported by the inside wall of the hollow body to ensure secure and fixed positioning. The cover is set on and covers an opposite end of the hollow body. Further, the substrate board can be of various shape or configuration to increase illumination angle of the light emitted from the light emission element and to expand heat dissipation area.

Abstract: A stricture of light-emitting diode includes a substrate, a board, light-emitting dies, and packages. The board forms spaced reflection receptacles, each of which has a side wall forming an inclined reflection surface. The board has a surface on which conductive traces are formed. The light-emitting dies are respectively received in the reflection receptacles, and each light-emitting die is electrically connected to the conductive traces of the board. The packages are respectively set in the reflection receptacles of the board. In this arrangement, no insulation layer is required for the substrate, so that efficient heat dissipation can be realized, and thermal resistance can be reduced to thereby improve the operation performance of the light-emitting dies. Further, the inclined reflection surface of the reflection receptacles can be made even and consistent.

Abstract: A structure of color temperature adjustable LED lamp includes a substrate, on which a plurality of cold white light LEDs and a plurality of additional LEDs are respectively mounted. The additional LEDs give off lights having a wavelength of 580-660 nm. The cold white light LEDs give off lights that are mixed with the lights from the additional LEDs to realize adjustment of the result color temperature as desired.

Abstract: A structure of lighting device includes a heat dissipater having opposite edges respectively forming a guide slot and a groove. A substrate board has an edge received and retained in the guide slot and an opposite edge forming a mounting hole. A fastener is received through the mounting hole to tightly engage the groove so as to fix the substrate board to the heat dissipater. No pre-machining of thread tapping is needed to form inner-threaded holes first. The structure of lighting device offers advantages in respect of simple structural arrangement, efficient manufacturing and production, reduced labor and material used, and lowering of costs.

Abstract: A light-emitting diode (LED) protection structure includes an LED portion and a protection portion. The protection portion includes a fuse and a Zener diode connected in series. The protection portion is electrically connected to the LED portion in parallel but opposite in direction. As such, the LED protection structure can effectively protect the LEDs and the Zener diode from being damaged to thereby reduce costs.

Abstract: A light-emitting diode (LED) protection structure includes an LED portion and a protection portion. The protection portion includes a fuse and a Zener diode connected in series. The protection portion is electrically connected to the LED portion in parallel but opposite in direction. As such, the LED protection structure can effectively protect the LEDs and the Zener diode from being damaged to thereby reduce costs.

Abstract: A structure of lighting device includes g a hood, a heat dissipater, at least one substrate board, and a fastener. The hood forms a receiving space, at least one fitting slot, and at least one heat dissipation opening. The fitting slot is located inside the receiving space. The heat dissipation opening is defined in a circumferential surface of the hood. The heat dissipater is received in the receiving space. The heat dissipater forms at least one guide section. The guide section opposes the fitting slot and is received in the fitting slot. The substrate board is electrically connected to at least one light-emitting diode. The substrate board is coupled to the heat dissipater. The heat dissipation opening allows for air circulation for removing heat generated by light-emitting diodes. Further, the heat dissipation opening is formed to have a width W less than 3mm, and the heat dissipater is arranged to be spaced from a circumferential surface of the hood by a distance greater than 6mm.

Abstract: An adjustable lighting device having a main body, a light generation device inserted into a receptacle, a movable lens, a base electrically connected to the light generation device, and an adjustor cover rotatably mounted to and covering the outside of the main body so that rotation of the adjustor cover causes the lens to extend/retract within the receptacle so that the extension/retraction of the lens can be controlled by the rotation of the adjustor cover for realizing focus adjustment.

Abstract: Disclosed is an improved light-emitting diode, which can be a PLCC or SMD type light-emitting diode. The light-emitting diode includes a package body, at least one pair of conductive terminals, and an optic lens. The package body has an end surface, a circumferential surface extending from the end surface, and a receptacle for accommodating a light-emitting chip. The pair of conductive terminals is fixed to the package body. The optic lens covers the end surface of the package body and is even expanded to cover the circumferential surface of the package body. In this way, effects of improved bonding strength, improved optic advantages, being easy to adjust to a desired angle with the optic lens, and alleviation of troubles caused by overflow of adhesive can be realized.

Abstract: A lighting bar assembly includes at least two lighting bar and at least one connector. Each lighting bar of the at least two lighting bars includes an enclosure, a circuit board, at least one power supply device, four male terminals, and two end caps. The enclosure is coupled to the circuit board. The circuit board includes a plurality of light-emitting diodes. The enclosure forms an interior space receiving the at least one power supply device. Each male terminal, the at least one power supply device and the circuit board are in electrical connection with one another. Opposite ends of the enclosure are respectively closed by the two end caps with the two end caps being in tight engagement with the enclosure. Each end cap forms a connection window in which the at least one connector is fit into the connection windows of the end caps. As such, advantages of easy manufacturing, enhanced lighting, small size, and easy replacement can be obtained.

Abstract: A method of manufacturing an infrared rays receiver comprises the steps of: chip attach; wire bonding; encapsulation; metal housing covering; encapsulation; pin cutting; and testing. A lead frame has several pins, wherein one pin has a coupling part. An infrared rays receiving chip is coupled to the coupling part of the pin of the lead frame, and electrically connected to the other pins by bonding wires. Thereafter, a light-pervious adhesive encapsulates part of the lead frame, the chip, and the bonding wires. Thereafter, the light-pervious adhesive is covered with a metal housing having a through hole so as to expose the infrared rays receiving chip via the through hole. Thereafter, the metal housing and the light-pervious adhesive are encapsulated into a unity by a colored adhesive. Consequently, the infrared rays receiver is protected from the occurrence of short circuits and has a metal shielding effect to provide a longer transmission distance.

Abstract: A light source structure of a backlight module comprises: a bar-shaped light source; and a group of complementary color light emitting diodes mounted at both ends of the bar-shaped light source. The bar-shaped light source is composed of several light emitting diodes having complementary light colors. The luminous intensity of outermost light emitting diodes of the bar-shaped light source is 30 to 70% of average luminous intensity of the other equal color light emitting diodes. The complementary color light emitting diodes have light colors complementary to that of the outermost light emitting diodes of the bar-shaped light source. The luminous intensity of the complementary color light emitting diodes is 10 to 50% of average luminous intensity of the other equal color light emitting diodes of the bar-shaped light source. Consequently, the non-uniform mixing of lights on edges of the backlight module and the producing of bright point can be avoided.

Abstract: A high brightness light emitting diode (LED) includes a base, a reflector cap, LED dices, a plastic layer, a lens, and a silicon rubber layer. Conductive terminals extend from the base for connection with an external power source. The base defines a bore receiving the cap with a bottom of the cap exposed. The cap forms a cavity receiving the LED dices, which are electrically connected to the conductive terminals. The plastic layer comprising PPA, LCP, or engineer plastics is filled in the cavity o with ends of the terminals extending beyond the plastic layer. The lens is positioned over the plastic layer and has projections that snugly fit over and engage the base. The silicon rubber layer is interposed between the lens and the base. With such an arrangement, lights from the LED dices can be mixed twice for enhanced uniformity of brightness of the light distribution.

Abstract: A sideway-emission light emitting diode includes a light emitting diode package comprised of a light emitting diode dice that gives off light and a lens that is positioned in front of a front end face of the package for receiving the light and redirecting the received light toward a circumference of the package and a light guide comprised of a board defining a cavity to receive and retain the light emitting diode package therein. The board has opposite sides each forming a cut-off delimited by opposite inclined edges, a refraction section extending from each inclined edge, and a projection section formed between opposite refraction sections, whereby light transmitting into the light guide is directed, by means of the reflection/refraction by the inclined edges, the refraction sections and the projection sections, toward and projected from the projection sections in sideway directions.

Abstract: A solid-state semiconductor light emitting device is disclosed. A heat sink that comprises a receiving cup for receiving a chip is provided. A leadframe that comprises a connection base is mounted above the heat sink, wherein the chip is connected to the leadframe via a metal wire and a resin or silicone is applied to cover all of them so as to form the a light emitting device that emits light. In the leadframe, two holders that include two top sides on their two top portions are opposite to one another, and a holder having holes is mounted between these two top sides. The holder having the holes is connected to one of these two opposite holders. A plastic material is applied to mold the three holders into the connection base for receiving the receiving cup of the heat sink. As a result, the heat sink provides with good heat-dissipating efficacy and each holder of the leadframe also provides with heat-dissipating efficacy and enhances connection stability as well.

Abstract: A light emitting diode (LED) includes a base, a reflector cup, a plurality of LED dices, a plastic layer, and a glass lens. External terminals are mounted in the base. The reflector cup is received and fixed in the base and forms a recess in which the dices are received and fixed. The dices are connected by conductors to the external terminals. The plastic layer is filled in the base to seal the reflector cup, the dices, the conductors, and portions of the external terminals. A bottom of the reflector cup is exposed outside the plastic layer and the external terminals extend beyond the plastic layer. The lens is made of glass containing fluorescent powders and is positioned on the plastic layer at a position corresponding to the dices. The glass lens that has a high melting point offers an excellent heat resistance and thus enhances the life span and reliability of the LED.