Patents Assigned to Universal Energy Systems, Inc.
  • Patent number: 5192523
    Abstract: A method of depositing a diamondlike carbon coating on a substrate. An ionized beam of pure methane or methane and hydrogen, and having an ion kinetic energy in the range of 500-1,000 eV is impinged on a substrate to deposit, thereon, a diamondlike carbon coating. Various substrates can be utilized, and various cleaning procedures are developed for use with the particular substrates to improve the adhesion of the diamondlike carbon coatings. The methane-hydrogen ratio and the operating pressure of the ionized gas can each be varied to vary the carbon-hydrogen ratio of the resulting diamondlike coating to thereby alter the characteristics of the coating.
    Type: Grant
    Filed: May 28, 1991
    Date of Patent: March 9, 1993
    Assignee: Universal Energy Systems, Inc.
    Inventors: Richard L. Wu, Peter P. Pronko
  • Patent number: 5147808
    Abstract: A silicon on insulator structure and method of making the structure. A high purity, substantially defect free silicon wafer is the basis for forming a final thin silicon layer on an insulator layer, the silicon having substantially the same chemical and structural state as the starting silicon wafer. Dopant atoms of MeV energy range are implanted into the silicon wafer, the silicon wafer having an insulator layer coupled thereto; and an underlying silicon carrier wafer is coupled to the insulator. The implanted silicon wafer undergoes preferential etch stop removal of the silicon up to the implanted dopant layer, followed by selective removal of the dopant atom layer, leaving the desired high quality silicon layer on an insulator substrate.
    Type: Grant
    Filed: April 12, 1990
    Date of Patent: September 15, 1992
    Assignee: Universal Energy Systems, Inc.
    Inventor: Peter P. Pronko
  • Patent number: 5136344
    Abstract: A silicon on insulator structure and method of making the structure. A high purity, substantially defect free silicon wafer is the basis for forming a final thin silicon layer on an insulator layer, the silicon having substantially the same chemical and structural state as the starting silicon wafer. Dopant atoms of MeV energy range are implanted into the silicon wafer, the silicon wafer haivng an insulator layer coupled thereto; and an underlying silicon carrier wafer is coupled to the insulator. The implanted silicon wafer undergoes preferential etch stop removal of the silicon up to the implanted dopant layer, followed by selective removal of the dopant atom layer, leaving the desired high quality silicon layer on an insulator substrate.
    Type: Grant
    Filed: November 26, 1990
    Date of Patent: August 4, 1992
    Assignee: Universal Energy Systems, Inc.
    Inventor: Peter P. Pronko
  • Patent number: 4863810
    Abstract: A method of providing corrosion resistant substrates having an amorphous metallic alloy coating thereon. The method comprises depositing refractory and transition elements, such as Ni, Nb, Ti and Cr, onto the substrate to provide a crystalline metallic layer thereon which is then irradiated to convert the layer into an amorphous metallic coating on the substrate. The coated substrate displays a corrosion resistance which is at least about four orders of magnitude greater than for the uncoated substrate in both lN HNO.sub.3 and 0.1 N NaCl aqueous solutions.
    Type: Grant
    Filed: September 21, 1987
    Date of Patent: September 5, 1989
    Assignee: Universal Energy Systems, Inc.
    Inventors: Rabi S. Bhattacharya, Amarendra K. Rai, Peter P. Pronko, Charbel Raffoul