Patents Assigned to UNIVERSITY HASSELT
  • Diamond Enhanced Thickness Shear Mode Resonator
    Publication number: 20080157632
    Abstract: A thickness shear mode (TSM) resonator is described, comprising a diamond layer. The diamond layer is preferably a high quality diamond layer with at least 90% sp3 bonding or diamond bonding. A method for manufacturing such a resonator is also described. The thickness shear mode resonator according to embodiments described herein may advantageously be used in biosensor application and in electrochemistry applications.
    Type: Application
    Filed: November 21, 2007
    Publication date: July 3, 2008
    Applicants: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC), UNIVERSITY HASSELT
    Inventor: Oliver Williams