Abstract: A low-carbon and low alloy hot-work die steel with a high toughness at low temperatures and a high strength at high temperatures and a high hardenability, comprises the following components: C: 0.15-0.35%, Si: 0.40-0.90%, Mn: ?0.80%, Cr: 1.50-2.40%, Ni: 2.50-4.50%, Mo: 1.00-1.60%, V: 0.10-0.40%, W: 0.20-0.90%, P: ?0.02%, S?0.02%, and a balance of Fe matrix and other inevitable impurities. The above percentages are mass percentages. The material of the present invention can have a V notch impact energy of 30 J or more than 30 J at ?40° C., a high temperature strength of 380 MPa or more at 700° C., and a hardenability of 200 mm or more to ensure the consistency of internal and external microstructures. The materials of the present invention can be applied to hot-work molds used in special working conditions that require high toughness at low temperatures, high strength at high temperatures and high hardenability.
Type:
Grant
Filed:
October 14, 2021
Date of Patent:
April 16, 2024
Assignee:
University of Science & Technology Beijing
Inventors:
Jinfeng Huang, Jin Zhang, Chao Zhao, Cheng Zhang
Abstract: A 1 GPa high-strength high-modulus aluminum-based light medium-entropy alloy and a preparation method thereof. An atomic expression of the designed medium-entropy alloy is AlxLiyMgzZnuCuv, subscripts representing the molar percentage of each corresponding alloy element, where x+y+z+u+v=100, x is 79.5-80.5, y is 1.5-2.5, z is 1.5-2.5, u is 13.5-14.5, and v is 1.5-2.5. The phase structure of the involved alloy is mainly based on a face-centered cubic (FCC) solid solution. The present invention obtains high performance aluminum alloy ingots through vacuum induction smelting and direct casting, and features low energy consumption, decreased cost, and simple operation in the preparation process, which cater to the high requirements on cost, strength and plasticity of light alloys applied in the high-end manufacturing industries such as aerospace and automobile electronics nowadays.
Type:
Grant
Filed:
October 18, 2019
Date of Patent:
June 14, 2022
Assignee:
University of Science & Technology Beijing
Inventors:
Yong Zhang, Ruixuan Li, Tao Zhang, Yangde Li
Abstract: The present disclosure provides a full-duplex wireless communication method, an antenna device and a full-duplex wireless communication system. The method includes steps of: within a training period, acquiring a relevant parameter for cancelling a self-interference signal from an antenna itself as a first estimated value, and a relevant parameter for cancelling a cross-interference signal between the antenna and the other antenna as a second estimated value; and within a data transmission period, receiving and transmitting signals simultaneously by the antenna using an identical frequency, cancelling the self-interference signal from the antenna itself in accordance with the first estimated value, and cancelling the cross-interference signal between the antenna and the other antenna in accordance with the second estimated value.
Type:
Grant
Filed:
December 3, 2015
Date of Patent:
March 6, 2018
Assignee:
University of Science & Technology Beijing
Abstract: The present disclosure provides a full-duplex wireless communication method, an antenna device and a full-duplex wireless communication system. The method includes steps of: within a training period, acquiring a relevant parameter for cancelling a self-interference signal from an antenna itself as a first estimated value, and a relevant parameter for cancelling a cross-interference signal between the antenna and the other antenna as a second estimated value; and within a data transmission period, receiving and transmitting signals simultaneously by the antenna using an identical frequency, cancelling the self-interference signal from the antenna itself in accordance with the first estimated value, and cancelling the cross-interference signal between the antenna and the other antenna in accordance with the second estimated value.
Type:
Application
Filed:
December 3, 2015
Publication date:
February 23, 2017
Applicant:
University of Science & Technology Beijing