Abstract: Method as well as resulting electrode and capacitor. The method includes the following process steps: •. in a surface of a metal film substrate, etching microstructures with a predetermined roughness, •. depositing in said microstructures a metal or compound layer, •. converting said metal or compounds layer into metal nanoparticles, constituting a catalyst, •. growing cross linked nanotubes in said microstructures at said metal nanoparticle acting as catalysts.

Abstract: An on-chip supercapacitor has an electrode that includes one-dimensional silicon nano structures coated with a first layer of titanium nitride. The on-chip supercapacitor also includes a second layer of manganese dioxide deposited on the first layer. An associated method of providing an on-chip supercapacitor electrode on a silicon substrate includes providing a plurality of one-dimensional silicon nanostructures on a substrate, coating the one-dimensional silicon nanostructures with a first layer of titanium nitride, and coating a second layer of manganese dioxide onto the first layer.

Abstract: An on-chip supercapacitor having an electrode comprising one-dimensional silicon (Si) nanostructures (3) coated with a first layer (10) of titanium nitride (TiN). It further comprises a second layer (20) of manganese dioxide (MnO2) deposited on the first layer. An associated method is also disclosed.

Abstract: An on-chip supercapacitor constituted by a silicon substrate and a porous carbon layer positioned thereon, the carbon layer including pseudocapacitive materials. The invention also relates to the method for producing the supercapacitor and the porous material.