Abstract: An X-ray fluorescence thickness measuring devise includes a primary X-ray beam collimation and workpiece positioning system that markedly increases the detectable fluorescent X-radiation from diverse specimen calibration standards and workpieces subjected to measurement. The positioning system includes an optical viewing system that provides a video signal image of the specimen surface prior to and during specimen radiation without hazard to the unit operator and independent of the collimator bore selected. A further feature of the measuring device is that it includes a system which assures repetitive and accurate positioning of a selected collimator relative to the axis of the X-ray beam to obtain maximum beam transmission therethrough.
Type:
Grant
Filed:
February 24, 1986
Date of Patent:
August 22, 1989
Assignee:
UPA Technology, Inc.
Inventors:
Murray Weiser, William Silverman, Zvi Landau, Paul Finer, Cary I. Pincus
Abstract: Improved calibration standard construction for X-ray fluorescence thickness measurement gauges formed of one or more plated layers of known character and thickness disposed on an apertured supporting foil base and accessible to X-radiation through an aperture at the base of a conically shaped bore in a surrounding protective housing member.
Type:
Grant
Filed:
March 28, 1985
Date of Patent:
February 24, 1987
Assignee:
UPA Technology, Inc.
Inventors:
Paul Finer, Robert O. Wahl, William Silverman
Abstract: A beta backscatter type of measuring instrument including a workpiece positioning system to permit precise prepositioning of the workpiece surface to be subjected to radiation preparatory to moving the radiation source into operative proximity therewith.
Abstract: An aperture piece to be used in conjunction with backscatter instruments for measuring the thickness of a coating on a substrate of a concave workpiece. The aperture piece being selectively shaped so that a sample support surface, including an aperture through which radiation from a radioisotope is transmitted, may be inserted into the interior space defined by the concave workpiece to engage the concave surface. A method of calibrating backscatter instruments using the aperture piece to make correction for the failure to have a planar mating relation between the sample support surface and the concave workpiece.
Abstract: A probe guide for holding a coating thickness measurement probe in contact with a coated workpiece such that repeatable thickness measurements may be made without the necessity of the user manually positioning the probe head for proper contact. The probe guide having a probe holding assembly mounted on a stand; the probe holding assembly constructed to permit the probe to swivel freely in any direction about the geometric center of the probe head face. A workpiece holding means is provided for holding the workpiece against a probe head of the probe. By positioning the workpiece holding means to forceably move the workpiece into contact with the probe head face, the probe will swivel until the resultant vector through the center of moment of the static forces through the workpiece acting on the probe head at the point or points of contact between the workpiece surface and the face of the probe head passes through the geometric center of the probe head face.
Type:
Grant
Filed:
March 17, 1980
Date of Patent:
August 10, 1982
Assignee:
UPA Technology, Inc.
Inventors:
Robert O. Wahl, William D. Hay, Raymond J. Prohaska
Abstract: An improved probe assembly for measuring the conductivity of a plated through hole in a circuit board. The probe assembly having a longitudinal housing and including at the forward end thereof a segmented current injection electrode, each segment being spring biased forwardly and capable of independent movement longitudinally with respect to the housing between a forward position and rearward position. The segmented current injection electrode injecting current into the through hole substantially 360.degree. of the circular edge formed by the intersection of the walls defining the through hole and the surface of the circuit board. A voltage measurement electrode being a knife-blade electrode is positioned in the interstices between the segments of the current injection electrode. The voltage measurement electrode also being spring biased in a forward direction and capable of longitudinal movement between a forward position and a rearward position.
Type:
Grant
Filed:
June 14, 1979
Date of Patent:
January 13, 1981
Assignee:
UPA Technology, Inc.
Inventors:
Robert O. Wahl, Derek Lieber, Jay M. Lesser