Abstract: A heat sink arrangement for securing a specific heat sink in thermal contact with a central processing unit. The heat sink arrangement comprises a CPU homing, a finned heat sink and a heat sink holding unit. The CPU housing includes a frame having a square central hole thereon, an securing ring extended upwardly and perpendicularly from the border fringe of the top surface of the frame and having an threaded periphery surface and an inner size larger than the size of the square hole, and a holding means provided underneath the frame for firmly gripping the CPU housing on a CPU. The heat sink has a finned cylindrical upper portion, a square lower portion and a circular supporting rim formed outwardly therebetween. The square lower portion of the heat sink is adapted for inserting into the square hole of the CPU housing for urging upon the top surface of the CPU.