Patents Assigned to US.sup.3, Inc.
  • Plastic integrated circuit card with an enclosed reinforcement structure separated from an integrated circuit module for protecting the integrated circuit module
    Patent number: 6058017
    Abstract: A reinforcement structure to protect an integrated circuit module located within a smart card. The integrated circuit module is disposed in the smart card. The reinforcement structure, which has a modulus of elasticity higher than the modulus of elasticity of the smart card, is completely surrounded by the smart card and separated from the integrated circuit module. The integrated circuit module can also be completely surrounded by the smart card. In addition, the smart card can have a plurality of layers, with the integrated circuit module and/or the reinforcement structure extending into one or more of the card layers. The reinforcement structure relieves stress on the integrated circuit module during bending and torsion of the card.
    Type: Grant
    Filed: July 29, 1996
    Date of Patent: May 2, 2000
    Assignee: US.sup.3, Inc.
    Inventors: Charles F. Horejs, Jr., Thomas H. Templeton, Jr.
  • Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
    Patent number: 5581445
    Abstract: A reinforcement structure to protect an integrated circuit module located within a smart card. The reinforcement structure, which has a modulus of elasticity higher than the modulus of elasticity of the smart card, substantially laterally surrounds the integrated circuit module in certain embodiments. In other embodiments, the reinforcement structure is a plate positioned adjacent to the integrated circuit module. The reinforcement structure relieves stress on the integrated circuit module during bending and torsion of the card.
    Type: Grant
    Filed: February 14, 1994
    Date of Patent: December 3, 1996
    Assignee: US.sup.3, Inc.
    Inventors: Charles F. Horejs, Jr., Thomas H. Templeton, Jr.
  • Electrical interconnection for structure including electronic and/or electromagnetic devices
    Patent number: 5519201
    Abstract: A flexible structure includes two or more electronic and/or electromagnetic devices, electrical connection being made between the devices by flexible and compressible electrically conductive plugs located within cavities or holes formed within the flexible structure. The structure is assembled so that the plugs are compressed between electrical contacts formed on or connected to the respective devices. As a result, good electrical contact is maintained between the devices. Additionally, if the structure is flexible, when the flexible structure is bent or deformed, the plugs bend or deform with the rest of the flexible structure so that the electrical connections between the plugs and the respective device electrical contacts are not broken.
    Type: Grant
    Filed: April 29, 1994
    Date of Patent: May 21, 1996
    Assignee: US.sup.3, Inc.
    Inventors: Thomas H. Templeton, Jr., Charles F. Horejs, Jr.