Patents Assigned to UST, Inc.
  • Patent number: 8446071
    Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: May 21, 2013
    Assignee: UST, Inc.
    Inventors: Perry Kaminski, Yu-Chi Chu
  • Patent number: 8237335
    Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: August 7, 2012
    Assignee: UST, Inc.
    Inventors: Perry Kaminski, Yu-Chi Chu
  • Patent number: 7902728
    Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: March 8, 2011
    Assignee: UST, Inc.
    Inventors: Perry Kaminski, Yu-Chi Chu
  • Patent number: 7736619
    Abstract: A hydrogel coupling device for the transmission of ultrasound therethrough having a predetermined shape and comprising a hydrogen bonded composition comprising PVA, one or both of PVP and PEG, and the balance water. The predetermined shapes are formed and are then exposed to (a) one or more freeze/thaw cycles, (b) one or more dehydration/re-hydration cycles, or (c) one or more freeze/thaw cycles and one or more dehydration/re-hydration cycles. The shapes may further be irradiated with high energy radiation followed by heat treating.
    Type: Grant
    Filed: November 1, 2004
    Date of Patent: June 15, 2010
    Assignee: UST Inc.
    Inventors: Anthony M. Lowman, Larry L. Smith
  • Publication number: 20080262358
    Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.
    Type: Application
    Filed: June 27, 2008
    Publication date: October 23, 2008
    Applicant: UST, INC.
    Inventors: Perry Kaminski, Yu-Chi Chu
  • Patent number: 7405510
    Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: July 29, 2008
    Assignee: UST, Inc.
    Inventors: Perry Kaminski, Yu-Chi Chu
  • Patent number: 7378779
    Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: May 27, 2008
    Assignee: UST, Inc.
    Inventors: Perry Kaminski, Yu-Chi Chu
  • Patent number: 7305264
    Abstract: Noninvasive pain treatment of skeletal cancer metastases in cancer patients utilizing planar or focused ultrasound. The ultrasound energy preferably targets at the Periosteum or immediate soft-bone-tissue interface, where local sensory pain receptors are directly affected by the growing tumor, to generate heat to destroy local sensory pain receptors so as to interrupt or block the pain feedback pathway to the central nervous system.
    Type: Grant
    Filed: November 22, 2004
    Date of Patent: December 4, 2007
    Assignee: UST, Inc.
    Inventors: Eugene A. Larson, Perry W. Kaminski, Yu-Chi Chu
  • Publication number: 20070167803
    Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.
    Type: Application
    Filed: July 20, 2006
    Publication date: July 19, 2007
    Applicant: UST, INC.
    Inventors: Perry Kaminski, Yu-Chi Chu
  • Publication number: 20070052323
    Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.
    Type: Application
    Filed: July 20, 2006
    Publication date: March 8, 2007
    Applicant: UST, INC.
    Inventors: Perry Kaminski, Yu-Chi Chu
  • Publication number: 20070055183
    Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.
    Type: Application
    Filed: July 20, 2006
    Publication date: March 8, 2007
    Applicant: UST, INC.
    Inventors: Perry Kaminski, Yu-Chi Chu
  • Publication number: 20070055182
    Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.
    Type: Application
    Filed: July 20, 2006
    Publication date: March 8, 2007
    Applicant: UST, Inc.
    Inventors: Perry Kaminski, Yu-Chi Chu
  • Publication number: 20070049829
    Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.
    Type: Application
    Filed: July 20, 2006
    Publication date: March 1, 2007
    Applicant: UST, INC.
    Inventors: Perry Kaminski, Yu-Chi Chu