Patents Assigned to UST, Inc.
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Patent number: 8446071Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: GrantFiled: July 20, 2006Date of Patent: May 21, 2013Assignee: UST, Inc.Inventors: Perry Kaminski, Yu-Chi Chu
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Patent number: 8237335Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: GrantFiled: July 20, 2006Date of Patent: August 7, 2012Assignee: UST, Inc.Inventors: Perry Kaminski, Yu-Chi Chu
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Patent number: 7902728Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: GrantFiled: June 27, 2008Date of Patent: March 8, 2011Assignee: UST, Inc.Inventors: Perry Kaminski, Yu-Chi Chu
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Patent number: 7736619Abstract: A hydrogel coupling device for the transmission of ultrasound therethrough having a predetermined shape and comprising a hydrogen bonded composition comprising PVA, one or both of PVP and PEG, and the balance water. The predetermined shapes are formed and are then exposed to (a) one or more freeze/thaw cycles, (b) one or more dehydration/re-hydration cycles, or (c) one or more freeze/thaw cycles and one or more dehydration/re-hydration cycles. The shapes may further be irradiated with high energy radiation followed by heat treating.Type: GrantFiled: November 1, 2004Date of Patent: June 15, 2010Assignee: UST Inc.Inventors: Anthony M. Lowman, Larry L. Smith
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Publication number: 20080262358Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: ApplicationFiled: June 27, 2008Publication date: October 23, 2008Applicant: UST, INC.Inventors: Perry Kaminski, Yu-Chi Chu
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Patent number: 7405510Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: GrantFiled: July 20, 2006Date of Patent: July 29, 2008Assignee: UST, Inc.Inventors: Perry Kaminski, Yu-Chi Chu
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Patent number: 7378779Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: GrantFiled: July 20, 2006Date of Patent: May 27, 2008Assignee: UST, Inc.Inventors: Perry Kaminski, Yu-Chi Chu
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Patent number: 7305264Abstract: Noninvasive pain treatment of skeletal cancer metastases in cancer patients utilizing planar or focused ultrasound. The ultrasound energy preferably targets at the Periosteum or immediate soft-bone-tissue interface, where local sensory pain receptors are directly affected by the growing tumor, to generate heat to destroy local sensory pain receptors so as to interrupt or block the pain feedback pathway to the central nervous system.Type: GrantFiled: November 22, 2004Date of Patent: December 4, 2007Assignee: UST, Inc.Inventors: Eugene A. Larson, Perry W. Kaminski, Yu-Chi Chu
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Publication number: 20070167803Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: ApplicationFiled: July 20, 2006Publication date: July 19, 2007Applicant: UST, INC.Inventors: Perry Kaminski, Yu-Chi Chu
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Publication number: 20070052323Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: ApplicationFiled: July 20, 2006Publication date: March 8, 2007Applicant: UST, INC.Inventors: Perry Kaminski, Yu-Chi Chu
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Publication number: 20070055183Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: ApplicationFiled: July 20, 2006Publication date: March 8, 2007Applicant: UST, INC.Inventors: Perry Kaminski, Yu-Chi Chu
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Publication number: 20070055182Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: ApplicationFiled: July 20, 2006Publication date: March 8, 2007Applicant: UST, Inc.Inventors: Perry Kaminski, Yu-Chi Chu
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Publication number: 20070049829Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: ApplicationFiled: July 20, 2006Publication date: March 1, 2007Applicant: UST, INC.Inventors: Perry Kaminski, Yu-Chi Chu