Patents Assigned to UTAC DONGGUAN LTD
  • Thermal leadless array package with die attach pad locking feature
    Patent number: 9196504
    Abstract: Embodiments of the present invention are directed to a thermal leadless array package with die attach pad locking feature and methods of producing the same. A copper layer is half-etched on both surfaces to define an array of package contacts and a die attach pad. Each die attach pad is fully embedded in encapsulate material to provide a positive mechanical locking feature for better reliability. In some embodiments, the contacts include four active corner contacts.
    Type: Grant
    Filed: July 3, 2012
    Date of Patent: November 24, 2015
    Assignee: UTAC DONGGUAN LTD.
    Inventors: Albert Loh, Edward Then, Serafin Pedron, Jr., Saravuth Sirinorakul
  • THERMAL LEADLESS ARRAY PACKAGE WITH DIE ATTACH PAD LOCKING FEATURE
    Publication number: 20140008777
    Abstract: Embodiments of the present invention are directed to a thermal leadless array package with die attach pad locking feature and methods of producing the same. A copper layer is half-etched on both surfaces to define an array of package contacts and a die attach pad. Each die attach pad is fully embedded in encapsulate material to provide a positive mechanical locking feature for better reliability. In some embodiments, the contacts include four active corner contacts.
    Type: Application
    Filed: July 3, 2012
    Publication date: January 9, 2014
    Applicant: UTAC DONGGUAN LTD
    Inventors: Albert LOH, Edward THEN, Serafin PEDRON, JR., Saravuth Sirinorakul